@article{journals/mr/ChuCLCWSCCT17,
added-at = {2019-11-05T00:00:00.000+0100},
author = {Chu, David T. and Chu, Yi-Cheng and Lin, Jie-An and Chen, Yi-Ting and Wang, Chun-Chieh and Song, Yen-Fang and Chiang, Cheng-Cheng and Chen, Chih and Tu, King-Ning},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2284576f4fe33f261849b8c15e7c6608b/dblp},
ee = {https://doi.org/10.1016/j.microrel.2017.10.001},
interhash = {d185ef75de88c6d89b73c284b67993b1},
intrahash = {284576f4fe33f261849b8c15e7c6608b},
journal = {Microelectronics Reliability},
keywords = {dblp},
pages = {32-37},
timestamp = {2019-11-26T07:53:13.000+0100},
title = {Growth competition between layer-type and porous-type Cu3Sn in microbumps.},
url = {http://dblp.uni-trier.de/db/journals/mr/mr79.html#ChuCLCWSCCT17},
volume = 79,
year = 2017
}