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Disambiguation of "Ceuninck, Ward De"

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Advantage of In-situ over Ex-situ techniques as reliability tool: Aging kinetics of Imec's MCM-D discrete passives devices.

, , , , and . Microelectronics Reliability, 43 (9-11): 1785-1790 (2003)

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Ishaan Desai University of Stuttgart

preCICE Distribution Version v2404.0, , , , , , , , , and 14 other author(s). Software, (2024)

Jörg Desel

Das ist Informatik (Eds.) Springer, (2001)

Univ. -Prof. Dr. Gerd de Bruyn University of Stuttgart

Deepak Deepak University of Stuttgart

Short-circuit currents characterization for future converter-based power systems, , , , and . 27th International Conference on Electricity Distribution (CIRED 2023), page 2175-2179. Stevenage, Institution of Engineering and Technology, (2023)

Anda Degeratu University of Stuttgart

 

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Embedded Unit for Point-of-Care Impedance Based Biosensor Readout., , , , , , , , and . HPCC-ICESS, page 1571-1577. IEEE Computer Society, (2012)Determination of the thermal resistance and current exponent of heterojunction bipolar transistors for reliability evaluation., , , , , and . Microelectronics Reliability, 41 (9-10): 1591-1596 (2001)Optimizing the Thermal Read-Out Technique for MIP-Based Biomimetic Sensors: Towards Nanomolar Detection Limits., , , , , and . Sensors, 13 (7): 9148-9159 (2013)Lifetime modeling of intrinsic gate oxide breakdown at high temperature., , , , , and . Microelectronics Reliability, 47 (9-11): 1389-1393 (2007)MTF test system with AC based dynamic joule correction for electromigration tests on interconnects., , , , , and . Microelectronics Reliability, 44 (9-11): 1849-1854 (2004)Advantage of In-situ over Ex-situ techniques as reliability tool: Aging kinetics of Imec's MCM-D discrete passives devices., , , , and . Microelectronics Reliability, 43 (9-11): 1785-1790 (2003)Evidence for source side injection hot carrier effects on lateral DMOS transistors., , , , , , , and . Microelectronics Reliability, 44 (9-11): 1621-1624 (2004)High-resolution SILC measurements of thin SiO2 at ultra low voltages., , , , , , , , , and . Microelectronics Reliability, 42 (9-11): 1485-1489 (2002)A new method for the lifetime determination of submicron metal interconnects by means of a parallel test structure., , , , and . Microelectronics Reliability, 45 (3-4): 753-759 (2005)Combining Electrochemical Impedance Spectroscopy and Surface Plasmon Resonance into one Simultaneous Read-Out System for the Detection of Surface Interactions., , , , , , and . Sensors, 13 (11): 14650-14661 (2013)