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Thermal analysis for a SiGe HBT 40 watt 32 GHz clock 3D memory processor chip stack using diamond heat spreader layers., , , , , , , , , and 2 other author(s). 3DIC, page 1-7. IEEE, (2009)A three-dimensional DRAM using floating body cell in FDSOI devices., , , , , , and . DDECS, page 159-162. IEEE, (2012)Evaluating the Impact of the Girls Who Code Summer Immersion Program: (Abstract Only)., and . SIGCSE, page 1108. ACM, (2018)Demonstration of superconducting memory for an RQL CPU., , , , , , and . MEMSYS, page 321-323. ACM, (2018)High-Speed Reconfigurable Circuits for Multirate Systems in SiGe HBT Technology., , , , , , , , , and . Proceedings of the IEEE, 103 (7): 1181-1196 (2015)140 Gb/s Serializer Using Clock Doublers in 90 nm SiGe Technology., , , , , and . J. Solid-State Circuits, 50 (11): 2703-2713 (2015)Design of High-Speed Register Files Using SiGe HBT BiCMOS Technology., , , , , , , , and . IEEE Trans. on Circuits and Systems, 61-II (3): 178-182 (2014)Design of BiCMOS SRAMs for high-speed SiGe applications., , , , , , , , and . IET Circuits, Devices & Systems, 8 (6): 487-498 (2014)Thermal Modeling of 3-D Stacked DRAM Over SiGe HBT BiCMOS CPU., , , , , , , , , and . IEEE Access, (2015)