%0 Conference Paper %1 conf/3dic/ScheuermannTRWB16 %A Scheuermann, Michael %A Tian, Shurong %A Robertazzi, Raphael %A Wordeman, Matthew R. %A Bergeron, C. %A Jacobson, H. %A Restle, Phillip J. %A Silberman, Joel %A Tyberg, Christy %B 3DIC %D 2016 %I IEEE %K dblp %P 1-4 %T Thermal analysis of multi-layer functional 3D logic stacks. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2016.html#ScheuermannTRWB16 %@ 978-1-5090-1399-9

@inproceedings{conf/3dic/ScheuermannTRWB16, added-at = {2022-02-25T00:00:00.000+0100}, author = {Scheuermann, Michael and Tian, Shurong and Robertazzi, Raphael and Wordeman, Matthew R. and Bergeron, C. and Jacobson, H. and Restle, Phillip J. and Silberman, Joel and Tyberg, Christy}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/261958bbf6e0ec40cf280893493ba888f/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2016}, ee = {https://doi.org/10.1109/3DIC.2016.7969996}, interhash = {876c8f27328e00c911eaff39328abb46}, intrahash = {61958bbf6e0ec40cf280893493ba888f}, isbn = {978-1-5090-1399-9}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2022-03-01T07:21:15.000+0100}, title = {Thermal analysis of multi-layer functional 3D logic stacks.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2016.html#ScheuermannTRWB16}, year = 2016 }