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%0 Journal Article
%1 Riefer_CIPS2022
%A Riefer, M.
%A Winkler, J.
%A Strache, S
%A Kallfass, I
%D 2022
%J in Proc. International Conference on Integrated Power Electronics Systems (CIPS), Berlin
%K PUMA in update
%T Substrate Integrated Temperature Sensing for Bondless Power Modules
@article{Riefer_CIPS2022,
added-at = {2022-11-04T11:48:46.000+0100},
author = {Riefer, M. and Winkler, J. and Strache, S and Kallfass, I},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2e0d1f7652928fdd696a8e02b3048c703/ingmarkallfass},
date-added = {2021-01-21 16:14:11 +0100},
date-modified = {2021-11-07 19:34:44 +0100},
interhash = {4aff79fd17f4eb95958f622444642c8c},
intrahash = {e0d1f7652928fdd696a8e02b3048c703},
journal = {in Proc. International Conference on Integrated Power Electronics Systems (CIPS), Berlin},
keywords = {PUMA in update},
month = {Mar.},
timestamp = {2025-05-26T10:46:15.000+0200},
title = {Substrate Integrated Temperature Sensing for Bondless Power Modules},
year = 2022
}
