Holes and grooves created in parts made by laser additive manufacturing techniques generally have a widthexceeding 100 μm and aspect ratios well below 50, i.e. the depth to width ratio. The technique presented in thiswork involves a repeated cycle of adding single material layers using a continuous-wave (cw) laser, followed bylocalized drilling or slitting of the topmost layers using an ultrafast laser. This layer-by-layer additive/subtractivetechnique can be used to generate very narrow holes or slits (grooves) of unlimited aspect ratio. We demonstratethe potential of the technique by fabricating micro holes with a diameter < 50 μm and grooves with a width < 50μm, both with aspect ratios ≥ 150.
%0 Journal Article
%1 Henn.2025.Combining
%A Henn, Manuel
%A Buser, Matthias
%A Holder, Daniel
%A Hagenlocher, Christian
%A Onuseit, Volkher
%A Powell, John
%A Graf, Thomas
%D 2025
%I Elsevier BV
%J Optics & Laser Technology
%K ablation additivemanufacturing cutting drilling micromaterialprocessing myown peer ultrashortpulse
%P 113443
%R 10.1016/j.optlastec.2025.113443
%T Combining additive and subtractive laser processing to produce small holes and narrow grooves of unlimited depth
%U http://dx.doi.org/10.1016/j.optlastec.2025.113443
%V 192
%X Holes and grooves created in parts made by laser additive manufacturing techniques generally have a widthexceeding 100 μm and aspect ratios well below 50, i.e. the depth to width ratio. The technique presented in thiswork involves a repeated cycle of adding single material layers using a continuous-wave (cw) laser, followed bylocalized drilling or slitting of the topmost layers using an ultrafast laser. This layer-by-layer additive/subtractivetechnique can be used to generate very narrow holes or slits (grooves) of unlimited aspect ratio. We demonstratethe potential of the technique by fabricating micro holes with a diameter < 50 μm and grooves with a width < 50μm, both with aspect ratios ≥ 150.
@article{Henn.2025.Combining,
abstract = {Holes and grooves created in parts made by laser additive manufacturing techniques generally have a widthexceeding 100 μm and aspect ratios well below 50, i.e. the depth to width ratio. The technique presented in thiswork involves a repeated cycle of adding single material layers using a continuous-wave (cw) laser, followed bylocalized drilling or slitting of the topmost layers using an ultrafast laser. This layer-by-layer additive/subtractivetechnique can be used to generate very narrow holes or slits (grooves) of unlimited aspect ratio. We demonstratethe potential of the technique by fabricating micro holes with a diameter < 50 μm and grooves with a width < 50μm, both with aspect ratios ≥ 150.},
added-at = {2025-07-07T19:17:06.000+0200},
author = {Henn, Manuel and Buser, Matthias and Holder, Daniel and Hagenlocher, Christian and Onuseit, Volkher and Powell, John and Graf, Thomas},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2dfb354e388644450f8ff116ede3734f7/manuelhenn},
doi = {10.1016/j.optlastec.2025.113443},
interhash = {68884089e6ac80b2922b94b1f370a57b},
intrahash = {dfb354e388644450f8ff116ede3734f7},
issn = {0030-3992},
journal = {Optics & Laser Technology},
keywords = {ablation additivemanufacturing cutting drilling micromaterialprocessing myown peer ultrashortpulse},
month = dec,
pages = 113443,
publisher = {Elsevier BV},
timestamp = {2025-07-07T19:17:06.000+0200},
title = {Combining additive and subtractive laser processing to produce small holes and narrow grooves of unlimited depth},
url = {http://dx.doi.org/10.1016/j.optlastec.2025.113443},
volume = 192,
year = 2025
}
