%0 Conference Paper %1 mahadi-ul-coapeihsifbssfra2015 %A Hassan, Mahadi-Ul %A Keck, Jürgen %A Klauk, Hagen %A Kostelnik, Jan %A Mahsereci, Yigit %A Saller, Stefan %A Schreivogel, Alina %A Zaki, Tarek %A Burghartz, Joachim N. %B 2015 European Microelectronics Packaging Conference (EMPC) %C Piscataway, New Jersey %D 2015 %I IEEE %K INES %T Combining Organic And Printed Electronics in Hybrid System in Foil (HySiF) Based Smart Skin For Robotic Applications %@ 978-0-9568-0862-2

@inproceedings{mahadi-ul-coapeihsifbssfra2015, added-at = {2019-03-06T16:58:45.000+0100}, address = {Piscataway, New Jersey}, author = {Hassan, Mahadi-Ul and Keck, Jürgen and Klauk, Hagen and Kostelnik, Jan and Mahsereci, Yigit and Saller, Stefan and Schreivogel, Alina and Zaki, Tarek and Burghartz, Joachim N.}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/23dbf80d8bab877d27e0eb510a8ca646b/kevin.konnerth}, booktitle = {2015 European Microelectronics Packaging Conference (EMPC)}, eventdate = {2015-09-14/2015-09-16}, eventtitle = {European Microelectronics Packaging Conference (EMPC)}, interhash = {5a9fcd4dd91efbfb5047e106054173d2}, intrahash = {3dbf80d8bab877d27e0eb510a8ca646b}, isbn = {978-0-9568-0862-2}, keywords = {INES}, publisher = {IEEE}, timestamp = {2019-03-06T15:58:45.000+0100}, title = {Combining Organic And Printed Electronics in Hybrid System in Foil (HySiF) Based Smart Skin For Robotic Applications}, venue = {Friedrichshafen, Germany}, year = 2015 }