Wu, WH (Corresponding Author), Samsung Semicond, San Jose, CA 95134 USA.
Wu, Wanghua, Samsung Semicond, San Jose, CA 95134 USA.
Ito, Hiroyuki, Tokyo Inst Technol, Inst Innovat Res, Yokohama, Kanagawa 2268503, Japan.
Anders, Jens, Univ Stuttgart, Inst Smart Sensors & IMS CHIPS, D-70569 Stuttgart, Germany.
Ali, Ahmed M. A., Apple, Cupertino, CA 95014 USA.
Pillonnet, Gael, Univ Grenoble Alpes, CEA Leti, F-38000 Grenoble, France.
%0 Journal Article
%1 wu2022guest
%A Wu, Wanghua
%A Ito, Hiroyuki
%A Anders, Jens
%A Ali, Ahmed M. A.
%A Pillonnet, Gaël
%D 2022
%I IEEE
%J IEEE journal of solid state circuits
%K ubs_10005 ubs_20007 ubs_30182 ubs_40307 unibibliografie wos
%N 12
%P 3509-3513
%R 10.1109/JSSC.2022.3212205
%T Guest Editorial Introduction to the Special Issue on the 2022 IEEE International Solid-State Circuits Conference (ISSCC)
%V 57
@article{wu2022guest,
added-at = {2023-06-22T14:08:38.000+0200},
affiliation = {Wu, WH (Corresponding Author), Samsung Semicond, San Jose, CA 95134 USA.
Wu, Wanghua, Samsung Semicond, San Jose, CA 95134 USA.
Ito, Hiroyuki, Tokyo Inst Technol, Inst Innovat Res, Yokohama, Kanagawa 2268503, Japan.
Anders, Jens, Univ Stuttgart, Inst Smart Sensors & IMS CHIPS, D-70569 Stuttgart, Germany.
Ali, Ahmed M. A., Apple, Cupertino, CA 95014 USA.
Pillonnet, Gael, Univ Grenoble Alpes, CEA Leti, F-38000 Grenoble, France.},
author = {Wu, Wanghua and Ito, Hiroyuki and Anders, Jens and Ali, Ahmed M. A. and Pillonnet, Gaël},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2042583a4be15f4a773f8db2b5b25b266/unibiblio},
doi = {10.1109/JSSC.2022.3212205},
interhash = {1035aa78e6693cde912a3124d6b721b5},
intrahash = {042583a4be15f4a773f8db2b5b25b266},
issn = {{0018-9200} and {1558-173X}},
journal = {IEEE journal of solid state circuits},
keywords = {ubs_10005 ubs_20007 ubs_30182 ubs_40307 unibibliografie wos},
language = {eng},
number = 12,
pages = {3509-3513},
publisher = {IEEE},
research-areas = {Engineering},
timestamp = {2023-06-22T14:08:38.000+0200},
title = {Guest Editorial Introduction to the Special Issue on the 2022 IEEE International Solid-State Circuits Conference (ISSCC)},
unique-id = {WOS:000898896800003},
volume = 57,
year = 2022
}