D. Fauser, and H. Steeb. Dataset, (2021)Related to: Fauser, Dominik; Steeb, Holger, (2021), "Influence of Humidity on the Rheology of Thermoresponsive Shape Memory Polymers", Journal of Materials Science (under review).
DOI: 10.18419/darus-2023
Abstract
This data contains a Thermal Humid Mechanical Cycle (THMC) of Shape Memory Polymers (SMP). The SMP is a polyurethane-based Polymer, which is produced from SMP Technologies Inc. The SMP filament were processed with a 3D printer (Ultimaker 3, Ultimaker, Geldermarsen, Netherlands).The THMC is divided into a preheating step, a programming step and a stress-free recovery step.A preheating step was performed before the THMC, to relieve residual stresses stored by the manufacturing process.Then the temperature is set to T_trans = 55 °C and waited until the sample is in thermodynamic equilibrium.A displacement of s_max = 2.5 mm is performed and fixed. In the same step, the thermal chamber is set to cooling, by setting a lower temperature T_1 = 50 °C, to speed up the cooling process. In the next step the displacement s_max is kept fixed and the temperature is decreased to T_low = 30 °C.Once the sample is in thermodynamic equilibrium, the fixation is released and the stress free recovery step by setting the normal force to F_N = 0 N is performed. Humidity-dependent recovery of the initial geometry is performed by increasing the relative humidity to RH = 70 %.By performing a THMC, the thermal shape fixation and humidity-dependent shape recovery are captured. Here it can be seen that the programmed shape can also be recovered by higher humidity.
Fauser, Dominik/University of Stuttgart, Institute of Applied Mechanics (CE), Steeb, Holger/University of Stuttgart, Institute of Applied Mechanics (CE) & SC SimTech
Related to: Fauser, Dominik; Steeb, Holger, (2021), "Influence of Humidity on the Rheology of Thermoresponsive Shape Memory Polymers", Journal of Materials Science (under review)
%0 Generic
%1 fauser2021humidity
%A Fauser, Dominik
%A Steeb, Holger
%D 2021
%K darus mult ubs_10002 ubs_10021 ubs_20002 ubs_20019 ubs_30024 ubs_30165 ubs_40399 unibibliografie
%R 10.18419/darus-2023
%T Humidity and thermal triggered Shape Memory Effect - Rheology-based numerical modelling - Thermal Humid Mechanical Cycle
%X This data contains a Thermal Humid Mechanical Cycle (THMC) of Shape Memory Polymers (SMP). The SMP is a polyurethane-based Polymer, which is produced from SMP Technologies Inc. The SMP filament were processed with a 3D printer (Ultimaker 3, Ultimaker, Geldermarsen, Netherlands).The THMC is divided into a preheating step, a programming step and a stress-free recovery step.A preheating step was performed before the THMC, to relieve residual stresses stored by the manufacturing process.Then the temperature is set to T_trans = 55 °C and waited until the sample is in thermodynamic equilibrium.A displacement of s_max = 2.5 mm is performed and fixed. In the same step, the thermal chamber is set to cooling, by setting a lower temperature T_1 = 50 °C, to speed up the cooling process. In the next step the displacement s_max is kept fixed and the temperature is decreased to T_low = 30 °C.Once the sample is in thermodynamic equilibrium, the fixation is released and the stress free recovery step by setting the normal force to F_N = 0 N is performed. Humidity-dependent recovery of the initial geometry is performed by increasing the relative humidity to RH = 70 %.By performing a THMC, the thermal shape fixation and humidity-dependent shape recovery are captured. Here it can be seen that the programmed shape can also be recovered by higher humidity.
@misc{fauser2021humidity,
abstract = {This data contains a Thermal Humid Mechanical Cycle (THMC) of Shape Memory Polymers (SMP). The SMP is a polyurethane-based Polymer, which is produced from SMP Technologies Inc. The SMP filament were processed with a 3D printer (Ultimaker 3, Ultimaker, Geldermarsen, Netherlands).The THMC is divided into a preheating step, a programming step and a stress-free recovery step.A preheating step was performed before the THMC, to relieve residual stresses stored by the manufacturing process.Then the temperature is set to T_trans = 55 °C and waited until the sample is in thermodynamic equilibrium.A displacement of s_max = 2.5 mm is performed and fixed. In the same step, the thermal chamber is set to cooling, by setting a lower temperature T_1 = 50 °C, to speed up the cooling process. In the next step the displacement s_max is kept fixed and the temperature is decreased to T_low = 30 °C.Once the sample is in thermodynamic equilibrium, the fixation is released and the stress free recovery step by setting the normal force to F_N = 0 N is performed. Humidity-dependent recovery of the initial geometry is performed by increasing the relative humidity to RH = 70 %.By performing a THMC, the thermal shape fixation and humidity-dependent shape recovery are captured. Here it can be seen that the programmed shape can also be recovered by higher humidity.},
added-at = {2022-06-09T19:15:45.000+0200},
affiliation = {Fauser, Dominik/University of Stuttgart, Institute of Applied Mechanics (CE), Steeb, Holger/University of Stuttgart, Institute of Applied Mechanics (CE) & SC SimTech},
author = {Fauser, Dominik and Steeb, Holger},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/23411a8d7ecf6e91bf020e5761481ad84/unibiblio},
doi = {10.18419/darus-2023},
howpublished = {Dataset},
interhash = {fcfb2c40041854618e0806ea79dc39b7},
intrahash = {3411a8d7ecf6e91bf020e5761481ad84},
keywords = {darus mult ubs_10002 ubs_10021 ubs_20002 ubs_20019 ubs_30024 ubs_30165 ubs_40399 unibibliografie},
note = {Related to: Fauser, Dominik; Steeb, Holger, (2021), "Influence of Humidity on the Rheology of Thermoresponsive Shape Memory Polymers", Journal of Materials Science (under review)},
orcid-numbers = {Fauser, Dominik/0000-0001-7989-9159, Steeb, Holger/0000-0001-7602-4920},
timestamp = {2023-11-03T12:07:53.000+0100},
title = {Humidity and thermal triggered Shape Memory Effect - Rheology-based numerical modelling - Thermal Humid Mechanical Cycle},
year = 2021
}