%0 Generic %1 fauser2021humidity %A Fauser, Dominik %A Steeb, Holger %D 2021 %K %R 10.18419/darus-2023 %T Humidity and thermal triggered Shape Memory Effect - Rheology-based numerical modelling - Thermal Humid Mechanical Cycle %X This data contains a Thermal Humid Mechanical Cycle (THMC) of Shape Memory Polymers (SMP). The SMP is a polyurethane-based Polymer, which is produced from SMP Technologies Inc. The SMP filament were processed with a 3D printer (Ultimaker 3, Ultimaker, Geldermarsen, Netherlands).The THMC is divided into a preheating step, a programming step and a stress-free recovery step.A preheating step was performed before the THMC, to relieve residual stresses stored by the manufacturing process.Then the temperature is set to T_trans = 55 °C and waited until the sample is in thermodynamic equilibrium.A displacement of s_max = 2.5 mm is performed and fixed. In the same step, the thermal chamber is set to cooling, by setting a lower temperature T_1 = 50 °C, to speed up the cooling process. In the next step the displacement s_max is kept fixed and the temperature is decreased to T_low = 30 °C.Once the sample is in thermodynamic equilibrium, the fixation is released and the stress free recovery step by setting the normal force to F_N = 0 N is performed. Humidity-dependent recovery of the initial geometry is performed by increasing the relative humidity to RH = 70 %.By performing a THMC, the thermal shape fixation and humidity-dependent shape recovery are captured. Here it can be seen that the programmed shape can also be recovered by higher humidity.

@misc{fauser2021humidity, abstract = {This data contains a Thermal Humid Mechanical Cycle (THMC) of Shape Memory Polymers (SMP). The SMP is a polyurethane-based Polymer, which is produced from SMP Technologies Inc. The SMP filament were processed with a 3D printer (Ultimaker 3, Ultimaker, Geldermarsen, Netherlands).The THMC is divided into a preheating step, a programming step and a stress-free recovery step.A preheating step was performed before the THMC, to relieve residual stresses stored by the manufacturing process.Then the temperature is set to T_trans = 55 °C and waited until the sample is in thermodynamic equilibrium.A displacement of s_max = 2.5 mm is performed and fixed. In the same step, the thermal chamber is set to cooling, by setting a lower temperature T_1 = 50 °C, to speed up the cooling process. In the next step the displacement s_max is kept fixed and the temperature is decreased to T_low = 30 °C.Once the sample is in thermodynamic equilibrium, the fixation is released and the stress free recovery step by setting the normal force to F_N = 0 N is performed. Humidity-dependent recovery of the initial geometry is performed by increasing the relative humidity to RH = 70 %.By performing a THMC, the thermal shape fixation and humidity-dependent shape recovery are captured. Here it can be seen that the programmed shape can also be recovered by higher humidity.}, added-at = {2023-08-31T16:14:17.000+0200}, affiliation = {Fauser, Dominik/University of Stuttgart, Institute of Applied Mechanics (CE), Steeb, Holger/University of Stuttgart, Institute of Applied Mechanics (CE) & SC SimTech}, author = {Fauser, Dominik and Steeb, Holger}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/23411a8d7ecf6e91bf020e5761481ad84/puma-wartung}, doi = {10.18419/darus-2023}, howpublished = {Dataset}, interhash = {fcfb2c40041854618e0806ea79dc39b7}, intrahash = {3411a8d7ecf6e91bf020e5761481ad84}, keywords = {}, note = {Related to: Fauser, Dominik; Steeb, Holger, (2021), "Influence of Humidity on the Rheology of Thermoresponsive Shape Memory Polymers", Journal of Materials Science (under review)}, orcid-numbers = {Fauser, Dominik/0000-0001-7989-9159, Steeb, Holger/0000-0001-7602-4920}, timestamp = {2023-08-31T14:14:17.000+0200}, title = {Humidity and thermal triggered Shape Memory Effect - Rheology-based numerical modelling - Thermal Humid Mechanical Cycle}, year = 2021 }