%0 Conference Paper %1 conf/mixdes/PawlowskiDGB18 %A Pawlowski, Pawel %A Dabrowski, Adam %A Grenz, Marcin %A Bladowski, Michal %B MIXDES %D 2018 %I IEEE %K dblp %P 324-329 %T Reflow Oven for Heating and Soldering SMD and BGA Components. %U http://dblp.uni-trier.de/db/conf/mixdes/mixdes2018.html#PawlowskiDGB18 %@ 978-83-63578-14-5

@inproceedings{conf/mixdes/PawlowskiDGB18, added-at = {2018-08-20T00:00:00.000+0200}, author = {Pawlowski, Pawel and Dabrowski, Adam and Grenz, Marcin and Bladowski, Michal}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2da7fc36a8aca249236640b3ebc3a6606/dblp}, booktitle = {MIXDES}, crossref = {conf/mixdes/2018}, ee = {https://doi.org/10.23919/MIXDES.2018.8436841}, interhash = {3c28c8450248ae0e5fbbca800598ce73}, intrahash = {da7fc36a8aca249236640b3ebc3a6606}, isbn = {978-83-63578-14-5}, keywords = {dblp}, pages = {324-329}, publisher = {IEEE}, timestamp = {2019-09-27T18:33:57.000+0200}, title = {Reflow Oven for Heating and Soldering SMD and BGA Components.}, url = {http://dblp.uni-trier.de/db/conf/mixdes/mixdes2018.html#PawlowskiDGB18}, year = 2018 }