%0 Journal Article %1 journals/mr/ChenWEHQA18 %A Chen, Si %A Wang, Zhizhe %A En, Yunfei %A Huang, Yun %A Qin, Fei %A An, Tong %D 2018 %J Microelectronics Reliability %K dblp %P 52-66 %T The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface. %U http://dblp.uni-trier.de/db/journals/mr/mr91.html#ChenWEHQA18 %V 91

@article{journals/mr/ChenWEHQA18, added-at = {2019-05-31T00:00:00.000+0200}, author = {Chen, Si and Wang, Zhizhe and En, Yunfei and Huang, Yun and Qin, Fei and An, Tong}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2dbca6462811469e2f827804dd8d65b05/dblp}, ee = {https://doi.org/10.1016/j.microrel.2018.08.005}, interhash = {2c61ca99cab546611551dae622d39618}, intrahash = {dbca6462811469e2f827804dd8d65b05}, journal = {Microelectronics Reliability}, keywords = {dblp}, pages = {52-66}, timestamp = {2019-09-27T10:58:22.000+0200}, title = {The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr91.html#ChenWEHQA18}, volume = 91, year = 2018 }