S. Tenbohlen, C. Beura, and M. Siege. 2022 9th International Conference on Condition Monitoring and Diagnosis (CMD), page 5-10. Piscataway, IEEE, (2022)
J. Schabel, M. Zerrer, M. Kull, M. Beltle, and S. Tenbohlen. 2021 Joint IEEE International Symposium on Electromagnetic Compatibility, Signal, & Power Integrity, and EMC Europe, page 110-114. IEEE, (2021)
C. Beura, M. Beltle, and S. Tenbohlen. Proceedings of the 21st International Symposium on High Voltage Engineering, volume 2 of Lecture Notes in Electrical Engineering, page 1276-1285. Cham, Springer, (2019)
M. Koch, and S. Tenbohlen. Proceedings of the 21st International Symposium on High Voltage Engineering, volume 2 of Lecture Notes in Electrical Engineering, page 865-876. Cham, Springer, (2019)
D. Passow, M. Beltle, S. Tenbohlen, J. Hohloch, and R. Grund. Proceedings of the 21st International Symposium on High Voltage Engineering, volume 1 of Lecture Notes in Electrical Engineering, page 219-231. Cham, Springer, (2020)
S. Win, B. Adam, and S. Tenbohlen. 15th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON), page 197-200. IEEE, (2018)
D. Müller, M. Beltle, and S. Tenbohlen. 2018 International Symposium on Electromagnetic Compatibility (EMC Europe), page 84-89. Piscataway, NJ, IEEE, (2018)
S. Miyazaki, Y. Mizutani, M. Tahir, and S. Tenbohlen. 2018 IEEE International Conference on High Voltage Engineering and Application (ICHVE), Piscataway, NJ, IEEE, (2018)