Autor der Publikation

Effect of filler concentration of rubbery shear and bulk modulus of molding compounds.

, , , , , und . Microelectronics Reliability, 47 (2-3): 233-239 (2007)

Bitte wählen Sie eine Person um die Publikation zuzuordnen

Um zwischen Personen mit demselben Namen zu unterscheiden, wird der akademische Grad und der Titel einer wichtigen Publikation angezeigt. Zudem lassen sich über den Button neben dem Namen einige der Person bereits zugeordnete Publikationen anzeigen.

 

Weitere Publikationen von Autoren mit dem selben Namen

Molecular simulation on the material/interfacial strength of the low-dielectric materials., , , , , und . Microelectronics Reliability, 47 (9-11): 1483-1491 (2007)Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach., , , , und . Microelectronics Reliability, 44 (12): 1947-1955 (2004)Prediction of crack growth in IC passivation layers., , , , , und . Microelectronics Reliability, 44 (12): 2003-2009 (2004)Prediction of thermo-mechanical integrity of wafer backend processes., , , , , , und . Microelectronics Reliability, 44 (12): 2011-2017 (2004)Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions., , , , , , , und . Microelectronics Reliability, 46 (9-11): 1679-1684 (2006)Effect of filler concentration of rubbery shear and bulk modulus of molding compounds., , , , , und . Microelectronics Reliability, 47 (2-3): 233-239 (2007)Characterization of moisture properties of polymers for IC packaging., , , , , und . Microelectronics Reliability, 47 (9-11): 1685-1689 (2007)Characterization of the viscoelastic properties of an epoxy molding compound during cure., , und . Microelectronics Reliability, 52 (8): 1711-1718 (2012)Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach., , , , und . Microelectronics Reliability, 47 (12): 1989-1996 (2007)Prediction and verification of process induced warpage of electronic packages., , , , , , und . Microelectronics Reliability, 43 (5): 765-774 (2003)