Author of the publication

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

A Haptic Tele-operated System for Microassembly.

P. Estevez, S. Khan, P. Lambert, M. Porta, I. Polat, C. Scherer, M. Tichem, U. Staufer, H. Langen, and R. Schmidt. IPAS, volume 315 of IFIP Advances in Information and Communication Technology, page 13-20. Springer, (2010)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Marcel Kirschner University of Stuttgart

Marcel Winkler University of Stuttgart

Marcel Bauer University of Stuttgart

Marcel Breyer University of Stuttgart

Marcel Anselment University of Stuttgart

Other publications of authors with the same name

Magnetic Self-Assembly of Ultra-Thin Chips to Polymer Foils.E. Kuran, and M. Tichem. IEEE Trans. Automation Science and Engineering, 10 (3): 536-544 (2013)Design, Fabrication and Testing of Assembly Features for Enabling Sub-micron Accurate Passive Alignment of Photonic Chips on a Silicon Optical Bench.J. van Gurp, M. Tichem, and U. Staufer. IPAS, volume 371 of IFIP Advances in Information and Communication Technology, page 17-27. Springer, (2012)Tolerance Budgeting in a Novel Coarse-Fine Strategy for Micro-Assembly.V. Henneken, and M. Tichem. IPAS, volume 198 of IFIP, page 155-166. Springer, (2006)Morphological Classification of Hybrid Microsystems Assembly.I. Kurniawan, M. Tichem, and M. Bartek. IPAS, volume 198 of IFIP, page 133-147. Springer, (2006)A DFA Framework for Hybrid Microsystems.M. Tichem, and D. Tanase. IPAS, volume 260 of IFIP, page 13-22. Springer, (2008)A Haptic Tele-operated System for Microassembly.P. Estevez, S. Khan, P. Lambert, M. Porta, I. Polat, C. Scherer, M. Tichem, U. Staufer, H. Langen, and R. Schmidt. IPAS, volume 315 of IFIP Advances in Information and Communication Technology, page 13-20. Springer, (2010)Grasping and Interaction Force Feedback in Microassembly.M. Porta, and M. Tichem. IPAS, volume 315 of IFIP Advances in Information and Communication Technology, page 199-206. Springer, (2010)Design and Experimental Evaluation of an Electrostatic Micro-Gripping System.D. Lang, and M. Tichem. IPAS, volume 198 of IFIP, page 33-42. Springer, (2006)