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Disambiguation of "Bakir, Muhannad S."

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Thermal Reliability Considerations of Resistive Synaptic Devices for 3D CIM System Performance.

, , , , and . 3DIC, page 1-5. IEEE, (2021)

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S. Schumann

S. Seemann

S. Wartzack

Boettinger S

S. Toro

 

Other publications of authors with the same name

3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation., , , , , , , and . CICC, page 663-670. IEEE, (2008)Electrical and fluidic microbumps and interconnects for 3D-IC and silicon interposer., and . SoCC, page 159-164. IEEE, (2012)Chip-to-chip interconnect integration technologies., , , , and . IEICE Electronic Express, 13 (6): 20162001 (2016)Electrical and Performance Benefits of Advanced Monolithic Cooling for 2.5D Heterogeneous ICs., , , and . 3DIC, page 1-5. IEEE, (2021)Revolutionary NanoSilicon Ancillary Technologies for Ultimate-Performance Gigascale Systems., , and . CICC, page 421-428. IEEE, (2007)Co-design of signal, power, and thermal distribution networks for 3D ICs., , , , , , and . DATE, page 610-615. IEEE, (2009)Embedded cooling technologies for densely integrated electronic systems., , , , , , , and . CICC, page 1-8. IEEE, (2015)Chip-level and Input/Output Interconnects for Gigascale SOCs: Limits and Opportunities., and . SoCC, page 323-324. IEEE, (2006)Nanoelectronics in retrospect, prospect and principle., , , and . ISSCC, page 31-35. IEEE, (2010)Au-NiW Mechanically Flexible Interconnects (MFIs) and TSV integration for 3D interconnects., , , , and . 3DIC, page 1-4. IEEE, (2014)