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New coaxial through silicon via (TSV) applied for three dimensional integrated circuits (3D ICs)., , , , , and . IEICE Electronic Express, 13 (8): 20160192 (2016)Universal closed-form expressions for the inductance of tapered through silicon vias (T-TSVs) based on vector magnetic potential., , , , , and . IEICE Electronic Express, 13 (18): 20160621 (2016)An Empirical Study on Pronoun Resolution in Chinese., and . CICLing, volume 2945 of Lecture Notes in Computer Science, page 213-216. Springer, (2004)Real-time quality monitoring and predicting model based on error propagation networks for multistage machining processes., , , and . J. Intelligent Manufacturing, 25 (3): 521-538 (2014)Fast Recommendations With the M-Distance., , , and . IEEE Access, (2016)Simulation of Ground Clutter Based on GPU and RTX., , , , and . AsiaSim/SCS AutumnSim (1), volume 643 of Communications in Computer and Information Science, page 452-459. (2016)Design of an RFID-Based Manufacturing Data Tracking System in Plant Production., , and . ICIRA (2), volume 5315 of Lecture Notes in Computer Science, page 688-696. Springer, (2008)Link-based identification of survival time-related biological pathways., , , and . BIBM, page 39-45. IEEE Computer Society, (2014)Methods for multiple attribute decision making with hesitant fuzzy uncertain linguistic information and their application for evaluating the college English teachers' professional development competence.. Journal of Intelligent and Fuzzy Systems, 28 (3): 1243-1250 (2015)Approximate concept construction with three-way decisions and attribute reduction in incomplete contexts., and . Knowl.-Based Syst., (2016)