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mm 2 Inductively-Coupled Injection-Locking CDR for High-Speed DRAM Interface.

Y. Take, N. Miura, and T. Kuroda. J. Solid-State Circuits, 46 (11): 2552-2559 (2011)

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Jens Take University of Stuttgart

Dr. Gunnar Take University of Stuttgart

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Circuit and package design for 44GB/s inductive-coupling DRAM/SoC interface.A. Okada, A. Junaidi, Y. Take, A. Kosuge, and T. Kuroda. ASP-DAC, page 44-45. IEEE, (2015)Design and analysis for ThruChip design for manufacturing (DFM).L. Hsu, Y. Take, A. Kosuge, S. Hasegawa, J. Kadamoto, and T. Kuroda. ASP-DAC, page 46-47. IEEE, (2015)Through Chip Interface Based Three-Dimensional FPGA Architecture Exploration.L. Hsu, M. Motomura, Y. Take, and T. Kuroda. IEICE Transactions, 98-C (4): 288-297 (2015)A Scalable 3D Heterogeneous Multicore with an Inductive ThruChip Interface.N. Miura, Y. Koizumi, Y. Take, H. Matsutani, T. Kuroda, H. Amano, R. Sakamoto, M. Namiki, K. Usami, M. Kondo and 1 other author(s). IEEE Micro, 33 (6): 6-15 (2013)Image sensor/digital logic 3D stacked module featuring inductive coupling channels for high speed/low-noise image transfer.M. Ikebe, D. Uchida, Y. Take, M. Someya, S. Chikuda, K. Matsuyama, T. Asai, T. Kuroda, and M. Motomura. VLSIC, page 82-. IEEE, (2015)Simultaneous 6-Gb/s Data and 10-mW Power Transmission Using Nested Clover Coils for Noncontact Memory Card.A. Radecki, Y. Yuan, N. Miura, I. Aikawa, Y. Take, H. Ishikuro, and T. Kuroda. J. Solid-State Circuits, 47 (10): 2484-2495 (2012)Efficient 3-D Bus Architectures for Inductive-Coupling ThruChip Interfaces.T. Kagami, H. Matsutani, M. Koibuchi, Y. Take, T. Kuroda, and H. Amano. IEEE Trans. VLSI Syst., 24 (2): 493-506 (2016)A 2.7Gb/s/mm2 0.9pJ/b/chip 1coil/channel ThruChip interface with coupled-resonator-based CDR for NAND Flash memory stacking.N. Miura, Y. Take, M. Saito, Y. Yoshida, and T. Kuroda. ISSCC, page 490-492. IEEE, (2011)A case for wireless 3D NoCs for CMPs.H. Matsutani, P. Bogdan, R. Marculescu, Y. Take, D. Sasaki, H. Zhang, M. Koibuchi, T. Kuroda, and H. Amano. ASP-DAC, page 23-28. IEEE, (2013)CMA-Cube: A scalable reconfigurable accelerator with 3-D wireless inductive coupling interconnect.Y. Koizumi, E. Sasaki, H. Amano, H. Matsutani, Y. Take, T. Kuroda, R. Sakamoto, M. Namiki, K. Usami, M. Kondo and 1 other author(s). FPL, page 543-546. IEEE, (2012)

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Disambiguation of "Take, Yasuhiro"

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A 30 Gb/s/Link 2.2 Tb/s/mm 2 Inductively-Coupled Injection-Locking CDR for High-Speed DRAM Interface.

Please choose a person to relate this publication to

Jens Take University of Stuttgart

Dr. Gunnar Take University of Stuttgart

Other publications of authors with the same name

Disambiguation

PUMA

Disambiguation of "Take, Yasuhiro"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML A 30 Gb/s/Link 2.2 Tb/s/mm 2 Inductively-Coupled Injection-Locking CDR for High-Speed DRAM Interface.

Please choose a person to relate this publication to

Jens Take University of Stuttgart

Dr. Gunnar Take University of Stuttgart

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

A 30 Gb/s/Link 2.2 Tb/s/mm 2 Inductively-Coupled Injection-Locking CDR for High-Speed DRAM Interface.