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Thermal Study on Leadframe Dimensioning for High Power Dissipation and Low Inductance Commutation Cells

, , , , and . PCIM Europe digital days 2020; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, page 1-8. (July 2020)

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Thermal Study on Leadframe Dimensioning for High Power Dissipation and Low Inductance Commutation Cells, , , , and . PCIM Europe digital days 2020; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, page 1-8. (July 2020)Thermisch und elektrisch optimiertes Leiterplatten-Prepackage für 100V 100A GaN Leistungshalbleiter, , , , and . in Proc. MikroSystemTechnik Kongress, Ludwigsburg, (November 2021)Application-Oriented Characterozation of Thermally-Optimized Asymmetricl Single Chip Packages for 100 V GaN HEMTs, , , , , and . in Proc. International Symposium on Power Semiconductor Devices and ICs (ISPSD), (2023)A 48 V, 300 kHz, High Current DC/DC-Converter Based on Paralleled, Asymmetrical and Thermally Optimized PCB Embedded GaN Packages with Integrated Temperature Sensor, , , , , and . in Proc. International Symposium on Power Semiconductor Devices and ICs (ISPSD), (2021)Comparison of thermally optimized SMD packages for 100 V GaN HEMTs in 300 kHz buck converter high current applications, , , and . in Proc. IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA), (2021)Asymmetric Packages for Optimal Performance of GaN-HEMT using PCB Fabrication Technology, , , , and . in Proc. PCIM Europe Conference, (2021)