Author of the publication

A distributed, reconfigurable, and reusable bist infrastructure for 3D-stacked ICs.

, , and . ITC, page 1-10. IEEE Computer Society, (2014)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

On Effective Through-Silicon Via Repair for 3-D-Stacked ICs., , and . IEEE Trans. on CAD of Integrated Circuits and Systems, 32 (4): 559-571 (2013)What Do You Mean My Board Test Stinks?. ITC, page 1423. IEEE Computer Society, (2004)Recap of the ITC15 Test Conference.. IEEE Design & Test, 33 (1): 85-86 (2016)On effective TSV repair for 3D-stacked ICs., , and . DATE, page 793-798. IEEE, (2012)A distributed, reconfigurable, and reusable bist infrastructure for 3D-stacked ICs., , and . ITC, page 1-10. IEEE Computer Society, (2014)Realizing High Test Quality Goals with Smart Test Resource Usage., , , , , , , and . ITC, page 525-533. IEEE Computer Society, (2004)FALCON: Rapid statistical fault coverage estimation for complex designs., , , , and . ITC, page 1-10. IEEE Computer Society, (2012)IEEE P1687: Toward Standardized Access of Embedded Instrumentation., , , , , , , , and . ITC, page 1-8. IEEE Computer Society, (2006)Status of IEEE Testability Standards 1149.4, 1532 and 1149.6., , , , , , , and . DATE, page 1184-1191. IEEE Computer Society, (2004)Simulation Based System Level Fault Insertion Using Co-verification Tools., , , , , and . ITC, page 704-710. IEEE Computer Society, (2004)