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Cross-sectional nanoprobing fault isolation technique on submicron devices.

P. Tan, H. Yap, C. Chen, F. Rivai, Y. Zhao, L. Zhu, H. Feng, H. Tan, R. He, D. Wang, Y. Huang, Y. Ma, J. Lam, and Z. Mai. Microelectronics Reliability, (2016)

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To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Xiangyin Tan University of Stuttgart

Tobias Tandler University of Stuttgart

Einsatz von KI bei der Prozessvorhersage für Bandsägen : Einsatz von künstlicher Intelligenz zur Vorhersage von Prozesskräften beim BandsägenT. Tandler, T. Hirth, R. Eisseler, T. Stehle, and H. Möhring. Werkstattstechnik, 113 (01-02): 29-35 (2023)

Tobias Tannert University of Stuttgart

Simon Tannert University of Stuttgart

Daniel Tandler University of Stuttgart

Other publications of authors with the same name

Cross-sectional nanoprobing sample preparation on sub-micron device with fast laser grooving technique.P. Tan, Y. Zhao, F. Rivai, B. Liu, Y. Pan, R. He, H. Tan, and Z. Mai. Microelectronics Reliability, (2018)Solving 28 nm I/O circuit reliability issue due to IC design weakness.Y. Low, P. Tan, S. Tan, Y. Zhao, and J. Lam. Microelectronics Reliability, (2018)Top-down delayering to expose large inspection area on die side-edge with Platinum (Pt) deposition technique.H. Yap, P. Tan, G. Low, M. Dawood, H. Feng, Y. Zhao, R. He, H. Tan, J. Zhu, B. Liu and 4 other author(s). Microelectronics Reliability, 55 (9-10): 1611-1616 (2015)Cross-sectional nanoprobing fault isolation technique on submicron devices.P. Tan, H. Yap, C. Chen, F. Rivai, Y. Zhao, L. Zhu, H. Feng, H. Tan, R. He, D. Wang and 4 other author(s). Microelectronics Reliability, (2016)Failure analysis on 14 nm FinFET devices with ESD CDM failure.S. Chithambaram, P. Tan, Y. Zhao, B. Liu, Y. Ma, A. Quah, D. Nagalingam, Y. Pan, and Z. Mai. Microelectronics Reliability, (2018)Application of Fast Laser Deprocessing Techniques on large cross-sectional view area sample with FIB-SEM dual beam system.Y. Zhao, Q. Wang, P. Tan, H. Yap, B. Liu, H. Feng, H. Tan, R. He, Y. Huang, D. Wang and 5 other author(s). Microelectronics Reliability, (2016)Application of laser deprocessing technique in PFA on chemical over-etched on bond-pad issue.H. Yap, P. Tan, L. Zhu, H. Feng, Y. Zhao, R. He, H. Tan, B. Liu, Y. Huang, D. Wang and 2 other author(s). Microelectronics Reliability, (2016)

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Disambiguation of "Tan, Pik Kee"

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Cross-sectional nanoprobing fault isolation technique on submicron devices.

Please choose a person to relate this publication to

Xiangyin Tan University of Stuttgart

Tobias Tandler University of Stuttgart

Tobias Tannert University of Stuttgart

Simon Tannert University of Stuttgart

Daniel Tandler University of Stuttgart

Other publications of authors with the same name

Disambiguation

PUMA

Disambiguation of "Tan, Pik Kee"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Cross-sectional nanoprobing fault isolation technique on submicron devices.

Please choose a person to relate this publication to

Xiangyin Tan University of Stuttgart

Tobias Tandler University of Stuttgart

Tobias Tannert University of Stuttgart

Simon Tannert University of Stuttgart

Daniel Tandler University of Stuttgart

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
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Cross-sectional nanoprobing fault isolation technique on submicron devices.