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Disambiguation of "Kumar, Shubham"

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A Physics-Based Model for Oxide-Semiconductor-Based Ferroelectric Field-Effect Transistors

, , , , , , , , and . IEEE transactions on materials for electron devices, 71 (7): 4397-4402 (2024)
DOI: 10.1109/TED.2024.3408776

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Maya Kumari University of Stuttgart

Dr. Pranav Kumar University of Stuttgart

Shreya Kumar University of Stuttgart

Manish Kumar University of Stuttgart

Tarun Kumar Mitruka Vinod Kumar Mitruka University of Stuttgart

 

Other publications of authors with the same name

Machine Learning Approach for Language Identification & Transliteration., , and . FIRE, page 60-64. ACM, (2014)Nontraditional Design of Dynamic Logics Using FDSOI for Ultra-Efficient Computing, , , , and . IEEE journal on exploratory solid-state computational devices and circuits, 9 (1): 74-82 (2023)Leveraging Ferroelectric Stochasticity and In-Memory Computing for DNN IP Obfuscation, , , , , , and . IEEE Journal on Exploratory Solid-State Computational Devices and Circuits, 8 (2): 102-110 (2022)Cross-Layer Reliability Modeling of Dual-Port FeFET : Device-Algorithm Interaction, , , , and . IEEE transactions on circuits and systems. 1, Fundamental theory and applications, 70 (7): 2891-2903 (2023)Invited Paper: Ultra-Efficient Edge AI Using FeFET-based Monolithic 3D Integration, , and . 2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD), IEEE, (2023)Knowledge Discovery from Semi-Structured Data for Conceptual Organization., , , , , , and . IAT Workshops, page 291-294. IEEE Computer Society, (2006)An Iterative Transient Rank Aggregation Technique for Mitigation of Rank Reversal., , , , and . IJSE, 9 (1): 40-50 (2018)Design and Analysis of New Efficient Multifin Low Leakage Switch Mode Power Supply., , and . ICTCS, page 97:1-97:5. (2016)Optimal Transistor Sizing of Full-Adder Block to Reduce Standby Leakage Power., , and . VDAT, volume 892 of Communications in Computer and Information Science, page 88-99. Springer, (2018)Frontiers in AI Acceleration : From Approximate Computing to FeFET Monolithic 3D Integration, , , , and . 2023 IFIP/IEEE 31st International Conference on Very Large Scale Integration (VLSI-SoC), page 1-6. IEEE, (2023)