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A 7Gb/s/link non-contact memory module for multi-drop bus system using energy-equipartitioned coupled transmission line.

, , , , , , and . ISSCC, page 52-54. IEEE, (2012)

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10.1 A 6Gb/s 6pJ/b 5mm-distance non-contact interface for modular smartphones using two-fold transmission-line coupler and EMC-qualified pulse transceiver., , , and . ISSCC, page 1-3. IEEE, (2015)Analytical thruchip inductive coupling channel design optimization., , , , , and . ASP-DAC, page 731-736. IEEE, (2016)Inductively-powered wireless solid-state drive (SSD) system with merged error correction of high-speed non-contact data links and NAND flash memory., , , , , , , and . VLSIC, page 128-. IEEE, (2015)A 0.15mm-thick non-contact connector for MIPI using vertical directional coupler., , , , , , , and . ISSCC, page 200-201. IEEE, (2013)A Study of Physical Design Guidelines in ThruChip Inductive Coupling Channel., , , , , and . IEICE Transactions, 98-A (12): 2584-2591 (2015)A 4.8x Faster FPGA-Based Iterative Closest Point Accelerator for Object Pose Estimation of Picking Robot Applications., , , , and . FCCM, page 331. IEEE, (2019)Analysis and Design of an 8.5-Gb/s/Link Multi-Drop Bus Using Energy-Equipartitioned Transmission Line Couplers., , , , and . IEEE Trans. on Circuits and Systems, 62-I (8): 2122-2131 (2015)A 12.5Gb/s/link non-contact multi drop bus system with impedance-matched Transmission Line Couplers and Dicode partial-response channel transceivers., , , , , and . ASP-DAC, page 91-92. IEEE, (2013)A 280 Mb/s In-Vehicle LAN System Using Electromagnetic Clip Connector and High-EMC Transceiver., , , , and . IEEE Trans. on Circuits and Systems, 63-I (2): 265-275 (2016)A 0.61-μJ/Frame Pipelined Wired-logic DNN Processor in 16-nm FPGA Using Convolutional Non-Linear Neural Network., , , and . IEEE Open J. Circuits Syst., (2022)