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Wafer-Level Chip-Scale Packaging for RF Applications

A. Polyakov, M. Bartek, J. Burghartz, P. Mendes, and H. Zurlo. (2003)

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Bioelectric Activity Recording based on a Single Electrode for Use on Wearable Devices.M. Fernandes, C. Pereira, J. Correia, and P. Mendes. BIODEVICES, page 130-134. SciTePress, (2011)Novel very small dual-band chip-size antenna for wireless sensor networksP. Mendes, M. Bartek, J. Burghartz, and J. Correia. Proceedings : 2004 IEEE Radio and Wireless Conference, page 419-422. Piscataway, New Jersey, IEEE, (2004)High-resistivity polycrystalline silicon as RF substrate in wafer-level packagingA. Polyakov, S. Sinaga, P. Mendes, M. Bartek, J. Correia, and J. Burghartz. Electronics Letters, 41 (2): 100-101 (January 2005)Integrated Chip-Size Antennas For Wireless Microsystems : Fabrication And Design ConsiderationsP. Mendes, A. Polyakov, M. Bartek, J. Burghartz, and J. Correia. Sensors and Actuators A: Physical, 125 (2): 217-222 (January 2006)Design and Tolerance Analysis Of A 5.7 GHz Chip-Size Microstrip Antenna On High Resistivity SiliconP. Mendes, J. Correia, M. Bartek, and J. Burghartz. (2003)Wafer-level integration of on-chip antennas and RF passives using high-resistivity polysilicon substrate technologyP. Mendes, S. Sinaga, A. Polyakov, M. Bartek, J. Burghartz, and J. Correia. 2004 Proceedings : 54th Electronic Components and Technology Conference, 2, page 1879-1884. Piscataway, New Jersey, IEEE, (2004)Integrated 5.7 GH size antenna for wireless sensor networksP. Mendes, A. Polyakov, M. Bartek, J. Burghartz, and J. Correia. TRANSDUCERS '03 : 12th International Conference on Solid-State Sensors, Actuators and Microsystems : Digest of Technical Papers, 1, page 49-52. Piscataway, New Jersey, IEEE, (2003)Analysis of Chip-Size Antennas on Lossy Substrates for Short-Range Wireless Micro SystemsP. Mendes, J. Correia, M. Bartek, and J. Burghartz. 2002 proceedings : SAFE-ProRISC-SeSens, November 27 - 29, 2002, Veldhoven, the Netherlands, page 51-54. (2002)Super-regenerative receiver at 433 MHz.J. Carmo, J. Ribeiro, P. Mendes, and J. Correia. Microelectronics Journal, 42 (5): 681-687 (2011)A Model to Improve the Accuracy of WSN Simulations.Ó. Gama, P. Carvalho, and P. Mendes. WWIC, volume 6649 of Lecture Notes in Computer Science, page 128-139. Springer, (2011)

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Disambiguation of "Mendes, Paulo Mateus"

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Wafer-Level Chip-Scale Packaging for RF Applications

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copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Wafer-Level Chip-Scale Packaging for RF Applications

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Wafer-Level Chip-Scale Packaging for RF Applications