%0 Conference Paper %1 polyakov2003waferlevel %A Polyakov, Aleksandr %A Bartek, Marian %A Burghartz, Joachim N. %A Mendes, Paulo Mateus %A Zurlo, H. %D 2003 %K INES firstnamemissing nomoreinformation %T Wafer-Level Chip-Scale Packaging for RF Applications

@inproceedings{polyakov2003waferlevel, added-at = {2019-03-27T15:56:52.000+0100}, author = {Polyakov, Aleksandr and Bartek, Marian and Burghartz, Joachim N. and Mendes, Paulo Mateus and Zurlo, H.}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/220d41ba1f7f5170c6bcd88c48fabbc70/kevin.konnerth}, interhash = {5ed37c24ca324e2aabe6a65067c07c2d}, intrahash = {20d41ba1f7f5170c6bcd88c48fabbc70}, keywords = {INES firstnamemissing nomoreinformation}, timestamp = {2019-04-09T09:18:06.000+0200}, title = {Wafer-Level Chip-Scale Packaging for RF Applications}, year = 2003 }