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Thermal behavior of self-heating effect in FinFET devices acting on back-end interconnects.

C. Chang, S. Liu, B. Lin, C. Chiu, Y. Lee, and K. Wu. IRPS, page 2. IEEE, (2015)

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C. Traut

C. Honold

Tim W{\"{u}}rtele

Kent W. Stewart

Other publications of authors with the same name

The Demonstration of Gate Dielectric-fuse 4kb OTP Memory Feasible for Embedded Applications in High-k Metal-gate CMOS Generations and Beyond.E. Hsieh, C. Chang, C. Chuang, H. Chen, and S. Chung. VLSI Circuits, page 208-. IEEE, (2019)Thermal behavior of self-heating effect in FinFET devices acting on back-end interconnects.C. Chang, S. Liu, B. Lin, C. Chiu, Y. Lee, and K. Wu. IRPS, page 2. IEEE, (2015)The Layout Design Language: A Technique for Generating Layout Plans.R. Grimsdale, and C. Chang. Comput. Graph. Forum, 15 (2): 97-106 (1996)Study of a new electromigration failure mechanism by novel test structure.L. Chen, B. Lin, M. Hsieh, C. Chang, J. Tsai, J. Peng, C. Chiu, and Y. Lee. IRPS, page 2. IEEE, (2015)System Identification and Robustness Analysis of the Circadian Regulatory Network via Microarray Data in Arabidopsis Thaliana.C. Li, W. Chang, and B. Chen. APBC, page 27-37. Imperial College Press, London, (2006)An effective calibration procedure for correction of parallax unmatched image pairs.H. Wang, C. Chang, and J. Yang. IET Image Processing, 3 (2): 63-74 (2009)The implementation of global logistic services using one-stop logistics management.A. Trappey, C. Trappey, D. Dai, S. Chang, and W. Lee. CSCWD, page 307-312. IEEE, (2014)Analyzing health insurance claims on different timescales to predict days in hospital.Y. Xie, G. Schreier, M. Hoy, Y. Liu, S. Neubauer, D. Chang, S. Redmond, and N. Lovell. Journal of Biomedical Informatics, (2016)Predicting number of hospitalization days based on health insurance claims data using bagged regression trees.Y. Xie, G. Schreier, D. Chang, S. Neubauer, S. Redmond, and N. Lovell. EMBC, page 2706-2709. IEEE, (2014)Real-time occupancy estimation using environmental parameters.M. Masood, Y. Soh, and V. Chang. IJCNN, page 1-8. IEEE, (2015)

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Disambiguation of "Chang, C. W."

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Thermal behavior of self-heating effect in FinFET devices acting on back-end interconnects.

Please choose a person to relate this publication to

C. Traut

C. Honold

Tim W{\"{u}}rtele

Tim W{\"{u}}rtele

Kent W. Stewart

Other publications of authors with the same name

Disambiguation

PUMA

Disambiguation of "Chang, C. W."

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Thermal behavior of self-heating effect in FinFET devices acting on back-end interconnects.

Please choose a person to relate this publication to

C. Traut

C. Honold

Tim W{\"{u}}rtele

Tim W{\"{u}}rtele

Kent W. Stewart

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Thermal behavior of self-heating effect in FinFET devices acting on back-end interconnects.