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3D laser direct-writing based mold fabrication for the manufacturing of diffractive-refractive elements, , , , , , , and . (May 2017)Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates, , , and . IEEE transactions on reliability, 66 (4): 1229-1237 (2017)Duroplaste – Hightech für die mikroelektronischen Packages von morgen, , and . (2017)3D laser direct-writing based mold fabrication for the manufacturing of diffractive-refractive elements, , , , , , , and . (2017)Practical Aspects and Limitations of Hermeticity Testing of Microencapsulations Using Cumulative Helium Leak Detection for Miniaturized Implantable Medical Devices, , , , , , and . IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3): 351-359 (March 2020)Flexible packaging by film assisted molding for micro assembly technologies based on PCB, , , , , , , , and . International Conference and Exhibition on Integration Issues of Miniaturized Smart Systems, (2015)Mass-producible micro-optical elements by injection compression molding and focused ion beam structured titanium molding tools, , , , , , , and . Optics Letters, 45 (5): 1184--1187 (March 2020)Erweiterung des Einsatzbereiches von laserstrukturierten 3D-MID durch die Verwendung von keramischen Substratmaterialien, , , , , , , , and . MikroSystemTechnik Congress 2021, (2021)Integration of nanoporous gold electrodes in microfluidic chambers by inkjet-printing for biosensing applications, , , , , , and . MikroSystemTechnik Congress 2021, page 476-478. (November 2021)On the influence of lid materials for flip-chip ball grid array package applications, , , , , and . Microelectronics reliability, 140 (January): 114869 (2023)