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New DfT architectures for 3D-SICs with a wireless test port.

Y. He, X. Cui, C. Lee, X. Cui, and Y. Jin. ASICON, page 1-4. IEEE, (2013)

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Dr. Xinxin Jing University of Stuttgart

Other publications of authors with the same name

A Novel Wafer-Level Packaging Solution For Mems.Z. Wang, G. Qi, J. Wei, P. Lim, Y. Jin, and C. Wong. International Journal of Computational Engineering Science, 4 (2): 339-342 (2003)Research on the structure of ultrathin Si PIN detector.P. Wang, D. Tian, S. Wang, M. Yu, and Y. Jin. NEMS, page 629-632. IEEE, (2013)Research on deep RIE-based through-Si-via micromachining for 3-D system-in-package integration.M. Miao, Y. Jin, H. Liao, L. Zhao, Y. Zhu, X. Sun, and Y. Guo. NEMS, page 90-93. IEEE Computer Society, (2009)Towards HMM based human motion recognition using MEMS inertial sensors.G. Shi, Y. Zou, Y. Jin, X. Cui, and W. Li. ROBIO, page 1762-1766. IEEE, (2008)PCA/ICA-based SVM for fall recognition using MEMS motion sensing data.G. Shi, Y. Zou, Y. Jin, and W. Li. APCCAS, page 69-72. IEEE, (2008)Hermetic Packaging Of Mems With Thick Electrodes By Silicon-Glass Anodic Bonding.Y. Jin, J. Wei, P. Lim, and Z. Wang. International Journal of Computational Engineering Science, 4 (2): 335-338 (2003)Fabrication Process and Performance Analysis of AlN based Piezoelectric Micromachined Ultrasonic Transducer with a Suspended Structure.L. Wang, Y. Chiu, D. Gong, S. Ma, Y. Yang, H. Li, H. Lee, H. Liu, and Y. Jin. NEMS, page 514-519. IEEE, (2019)Electrical characterization of integrated passive devices using thin film technology for 3D integration.X. Sun, Y. Zhu, Z. Liu, Q. hu Cui, S. Ma, J. Chen, M. Miao, and Y. Jin. Journal of Zhejiang University - Science C, 14 (4): 235-243 (2013)A new fast adopted image matching approach with arbitrary rotation.G. Sun, Z. Li, Y. Jin, J. Sun, K. Zheng, and D. Zhao. APSIPA, page 1-4. IEEE, (2013)A 3D micro-channel cooling system embedded in LTCC packaging substrate.S. Jia, M. Miao, R. Fang, S. Guo, D. Hu, and Y. Jin. NEMS, page 649-652. IEEE, (2012)

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Disambiguation of "Jin, Yufeng"

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New DfT architectures for 3D-SICs with a wireless test port.

Please choose a person to relate this publication to

Dr. Xinxin Jing University of Stuttgart

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PUMA

Disambiguation of "Jin, Yufeng"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML New DfT architectures for 3D-SICs with a wireless test port.

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Dr. Xinxin Jing University of Stuttgart

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Disambiguation

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New DfT architectures for 3D-SICs with a wireless test port.