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When Single Event Upset Meets Deep Neural Networks: Observations, Explorations, and Remedies.

, , , , , and . CoRR, (2019)

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Mixed-grained reconfigurable architecture supporting flexible reliability and C-based design., , , , , , , , and . ReConFig, page 1-6. IEEE, (2013)Statistical Timing Analysis Considering Spatially and Temporally Correlated Dynamic Power Supply Noise., , and . IEEE Trans. on CAD of Integrated Circuits and Systems, 28 (4): 541-553 (2009)Transistor Sizing of LCD Driver Circuit for Technology Migration., , , , and . IEICE Transactions, 90-A (12): 2712-2717 (2007)On-Chip Thermal Gradient Analysis Considering Interdependence between Leakage Power and Temperature., , , and . IEICE Transactions, 89-A (12): 3491-3499 (2006)Successive Pad Assignment for Minimizing Supply Voltage Drop., , and . IEICE Transactions, 88-A (12): 3429-3436 (2005)Adaptive performance compensation with in-situ timing error prediction for subthreshold circuits., , , and . CICC, page 215-218. IEEE, (2009)Measurement and analysis of delay variation due to inductive coupling., , and . CICC, page 305-308. IEEE, (2005)Design guideline for resistive termination of on-chip high-speed interconnects., , and . CICC, page 613-616. IEEE, (2005)An oscillator-based true random number generator with process and temperature tolerance., , and . ASP-DAC, page 4-5. IEEE, (2015)Area efficient device-parameter estimation using sensitivity-configurable ring oscillator., , , and . ASP-DAC, page 731-736. IEEE, (2015)