PUMA

academical publication management
collect, organize, and share publications

( en | de )

 

Disambiguation of "Römer, Ulrich"

Author of the publication

copydeleteadd this publication to your clipboard
Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging.

, , , and . CoRR, (2018)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Daniel Römer University of Stuttgart

Tristan Römer University of Stuttgart

Univ. -Prof. Dr. Ulrich Palm University of Stuttgart

Prof. Dr. Ulrich Weiß University of Stuttgart

Daniel Ulrich

 

Other publications of authors with the same name

Solving Parameter Estimation Problems with Discrete Adjoint Exponential Integrators., , and . CoRR, (2017)High Dimensional Uncertainty Quantification for an Electrothermal Field Problem using Stochastic Collocation on Sparse Grids and Tensor Train Decomposition., , , , and . CoRR, (2016)Recent Advances of Isogeometric Analysis in Computational Electromagnetics., , , , , , , , , and 1 other author(s). CoRR, (2017)Modeling of Spatial Uncertainties in the Magnetic Reluctivity., , and . CoRR, (2016)Determination of Bond Wire Failure Probabilities in Microelectronic Packages., , and . CoRR, (2016)A multilevel Monte Carlo method for high-dimensional uncertainty quantification of low-frequency electromagnetic devices., , , and . CoRR, (2018)A defect corrected finite element approach for the accurate evaluation of magnetic fields on unstructured grids., , and . J. Comput. Physics, (2017)Multilevel Monte Carlo Simulation of the Eddy Current Problem With Random Parameters., , , and . CoRR, (2017)Low-Dimensional Stochastic Modeling of the Electrical Properties of Biological Tissues., , , and . CoRR, (2016)Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging., , , and . CoRR, (2018)