%0 Journal Article %1 journals/corr/abs-1809-09034 %A Casper, Thorben %A Römer, Ulrich %A Schöps, Sebastian %A Gersem, Herbert De %D 2018 %J CoRR %K dblp %T Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging. %U http://dblp.uni-trier.de/db/journals/corr/corr1809.html#abs-1809-09034 %V abs/1809.09034

@article{journals/corr/abs-1809-09034, added-at = {2018-10-05T00:00:00.000+0200}, author = {Casper, Thorben and Römer, Ulrich and Schöps, Sebastian and Gersem, Herbert De}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/28a5f4f8aa2333d5f742b5e53162b912c/dblp}, ee = {http://arxiv.org/abs/1809.09034}, interhash = {424f1eda98619143bd5cc1a6d6503d28}, intrahash = {8a5f4f8aa2333d5f742b5e53162b912c}, journal = {CoRR}, keywords = {dblp}, timestamp = {2019-09-27T09:20:45.000+0200}, title = {Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging.}, url = {http://dblp.uni-trier.de/db/journals/corr/corr1809.html#abs-1809-09034}, volume = {abs/1809.09034}, year = 2018 }