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Low-Temperature Sintering of Nanometal Inks on Polymer Substrates

, , , , , , and . 2018 13th International Congress Molded Interconnect Devices (MID), IEEE, (2018)
DOI: 10.1109/ICMID.2018.8527053

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Low-Temperature Sintering of Nanometal Inks on Polymer Substrates, , , , , , and . 2018 13th International Congress Molded Interconnect Devices (MID), page 130. Molded Interconnect Devices 3-D MID e. V., IEEE, (September 2018)Low-Temperature Sintering of Nanometal Inks on Polymer Substrates, , , , , , and . 2018 13th International Congress Molded Interconnect Devices (MID), IEEE, (2018)Zero-Acreage Farming in the City of Berlin: An Aggregated Stakeholder Perspective on Potential Benefits and Challenges, , , , , , , and . Sustainability, 7 (4): 4511-4523 (2015)