Author of the publication

Investigations on Flexural Fatigue Strength of Conductor Paths Fabricated by LPKF-LDS (R) Technology

, , , , and . Journal of Micro and Nano-Manufacturing, 6 (1): 011004 (2018)
DOI: 10.1115/1.4038320

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Fine Pitch Metal Deposition on LDS Materials, , , and . 4M/ICOMM 2015: proceedings of the 4M/ICOMM2015 Conference, page 482-485. Research Publishing, (2015)4M / ICOMM2015 Conference.Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist, , , , , and . Micromachines, 12 (8): 856 (2021)Fabrication of Modules for an Interactive Braille Display with Integrated Touch Sensor by Laser MID Technology, , , , , , , and . Proceedings of the 6th International Conference on Multi-Material Micro Manufacture, (September 2009)Umspritzen von Si-Nacktchips mit Thermoplast und deren Kontaktierung mit der LPKF-LDS® Technik, , , , , , and . Beiträge zum 22. Stuttgarter Kunststoff-Kolloquium, (2011)Erweiterung des Einsatzbereiches von laserstrukturierten 3D-MID durch die Verwendung von keramischen Substratmaterialien, , , , , , , , and . MikroSystemTechnik Congress 2021, (2021)Erweiterung des Einsatzbereiches von laserstrukturierten 3D-MID durch die Verwendung von keramischen Substratmaterialien, , , , , , , , and . MikroSystemTechnik Kongress 2021, page 462-465. VDE Verlag GmbH, (2021)Integration of Bare Dies in Thermoplastic Packages Using Insert Injection Moulding and LPKF-LDS® Technology, , , , , and . Smart systems integration 2010 / 4th European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components, Como, Italy, 23 - 24 March 2010, (March 2010)Investigations on Flexural Fatique Strenght of Conductor Paths Fabricated by LPKF-LDS® Technology, , , , , and . Proceedings of 4M/IWMF2016, 4M Association, Research Publishing, (September 2016)Characterization of Hermetically Sealed Metallic Feedthroughs through Injection-Molded Epoxy-Molding Compounds, , , , , , , and . Applied Mechanics, 2 (4): 976-996 (2021)Generative Processes for Rapid Prototyping of MID: Methods and Potentials, , , , , , and . Proceedings of 12th International Congress Molded Interconnect Devices, (2016)