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Integration of Mechatronic Functions on Additively Manufactured Components via Laser-Assisted Selective Metal Deposition

, , , , and . Advanced functional materials, 34 (27): 2312833 (2024)
DOI: 10.1002/adfm.202312833

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Fine Pitch Metal Deposition on LDS Materials, , , and . 4M/ICOMM 2015: proceedings of the 4M/ICOMM2015 Conference, page 482-485. Research Publishing, (2015)4M / ICOMM2015 Conference.Evaluating thermoset resin substrates for 3D mechatronic integrated devices and packaging, , , , , , , and . IMAPS 2020 Symposium on Microelectronics : A Global Virtual Conference, 2020, 01, page 140-145. Pittsburgh, International Microelectronics And Packaging Society, (2020)Laserinduzierte Direktmetallisierung von Al2O3 und ZTA Keramiken für keramische 3D Schaltungsträger, , , , , , , , and . (May 2025)Umspritzen von Si-Nacktchips mit Thermoplast und deren Kontaktierung mit der LPKF-LDS® Technik, , , , , , and . Beiträge zum 22. Stuttgarter Kunststoff-Kolloquium, (2011)Fabrication of Modules for an Interactive Braille Display with Integrated Touch Sensor by Laser MID Technology, , , , , , , and . Proceedings of the 6th International Conference on Multi-Material Micro Manufacture, (September 2009)Erweiterung des Einsatzbereiches von laserstrukturierten 3D-MID durch die Verwendung von keramischen Substratmaterialien, , , , , , , , and . MikroSystemTechnik Congress 2021, (2021)Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist, , , , , and . Micromachines, 12 (8): 856 (2021)Characterization of Hermetically Sealed Metallic Feedthroughs through Injection-Molded Epoxy-Molding Compounds, , , , , , , and . Applied mechanics, 2 (4): 976-995 (2021)Evaluating thermoset resin substrates for 3D mechatronic integrated devices and packaging, , , , , , , and . International Symposium on Microelectronics, 2020 (1): 000140-000145 (January 2021)3D Conductive Tracks on Thermoset Packages for Advanced System Integration, , , , , , and . Proceedings of the 14th International Congress Molded Interconnect Devices, page 570-594. Molded Interconnect Devices 3-D MID e. V., (February 2021)