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Latchup Analysis Using Emission Microscopy., , , , , , , , , and . Microelectronics Reliability, 43 (9-11): 1603-1608 (2003)Faster IC Analysis with PICA Spatial Temporal Photon Correlation and CAD Autochanneling., , , , , , , and . Microelectronics Reliability, 43 (9-11): 1663-1668 (2003)Counterfeit IC detection using light emission., , and . ITC, page 1-8. IEEE Computer Society, (2014)Thermal-aware task scheduling at the system software level., , , , , and . ISLPED, page 213-218. ACM, (2007)MARVEL - Malicious alteration recognition and verification by emission of light., , , , , , , and . HOST, page 117-121. IEEE Computer Society, (2011)Keeping hot chips cool: are IC thermal problems hot air?, , , , , , and . DAC, page 634-635. ACM, (2008)Temperature-limited microprocessors: Measurements and design implications., , , , , , and . VLSI Design, page 427-432. IEEE Computer Society, (2007)Power management of multi-core chips: Challenges and pitfalls., , , , , , , , , and 1 other author(s). DATE, page 977-982. IEEE, (2012)Optical and Electrical Testing of Latchup in I/O Interface Circuits., , , , , , , and . ITC, page 236-245. IEEE Computer Society, (2003)Self-heating characterization of FinFET SOI devices using 2D time resolved emission measurements., , , , and . IRPS, page 2. IEEE, (2015)