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Fine Pitch Metal Deposition on LDS Materials

H. Mueller, S. Weser, W. Eberhardt, and H. Kück. Proceedings of the 4M/ICOMM2015 Conference, page 482-485. Singapore, Research Publishing, (2015)

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Sascha Kolatschek University of Stuttgart

Dr. -Ing. Sascha Klett University of Stuttgart

Sascha Stribick University of Stuttgart

Sascha Polatkan University of Stuttgart

Sascha Ritschel University of Stuttgart

Other publications of authors with the same name

Fine Pitch Metal Deposition on LDS MaterialsH. Mueller, S. Weser, W. Eberhardt, and H. Kueck. 4M/ICOMM 2015: proceedings of the 4M/ICOMM2015 Conference, page 482-485. Research Publishing, (2015)4M / ICOMM2015 Conference.Evaluating thermoset resin substrates for 3D mechatronic integrated devices and packagingF. Häußler, S. Shen, S. Petillon, S. Weser, M. Haybat, W. Eberhardt, A. Zimmermann, and J. Franke. IMAPS 2020 Symposium on Microelectronics : A Global Virtual Conference, 2020, 01, page 140-145. Pittsburgh, International Microelectronics And Packaging Society, (2020)Laserinduzierte Direktmetallisierung von Al2O3 und ZTA Keramiken für keramische 3D SchaltungsträgerA. Schilling, P. Ninz, S. Keller, S. Weser, A. Knoeller, W. Eberhardt, T. Guenther, F. Kern, and A. Zimmermann. (May 2025)Umspritzen von Si-Nacktchips mit Thermoplast und deren Kontaktierung mit der LPKF-LDS® TechnikV. Mayer, W. Eberhardt, A. Fischer, M. Schober, S. Weser, H. Willeck, and H. Kueck. Beiträge zum 22. Stuttgarter Kunststoff-Kolloquium, (2011)Fabrication of Modules for an Interactive Braille Display with Integrated Touch Sensor by Laser MID TechnologyA. Fischer, D. Ahrendt, W. Eberhardt, U. Keßler, M. Schubert, S. Weser, H. Willeck, and H. Kueck. Proceedings of the 6th International Conference on Multi-Material Micro Manufacture, (September 2009)Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask ResistF. Janek, N. Eichhorn, S. Weser, K. Gläser, W. Eberhardt, and A. Zimmermann. Micromachines, 12 (8): 856 (2021)Erweiterung des Einsatzbereiches von laserstrukturierten 3D-MID durch die Verwendung von keramischen SubstratmaterialienA. Schilling, P. Ninz, S. Petillon, S. Weser, A. Knöller, W. Eberhardt, T. Guenther, F. Kern, and A. Zimmermann. MikroSystemTechnik Congress 2021, (2021)Characterization of Hermetically Sealed Metallic Feedthroughs through Injection-Molded Epoxy-Molding CompoundsM. Haybat, T. Günther, R. Kulkarni, S. Sahakalkan, T. Grözinger, T. Rothermel, S. Weser, and A. Zimmermann. Applied mechanics, 2 (4): 976-995 (2021)Laserstrukturierungen von robusten 3D-SchaltungsträgernE. Ermantraut, H. Mueller, W. Eberhardt, S. Weser, and H. Kueck. (October 2013)New Laser based Patterning Processes for 3D DevicesH. Mueller, S. Weser, E. Ermantraut, W. Eberhardt, and H. Kueck. Proceedings of the 10 International Conference on Multi-Material Micro Manufacture, page 156-159. (2013)