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Selektive laserinduzierte Metallisierung von 3D-Schaltungsträgern aus Aluminiumoxid

, , , , , and . Keramische Zeitschrift, 72 (1): 42-47 (2020)
DOI: 10.1007/s42410-020-0102-7

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Kai Simon University of Stuttgart

Rigid Glulam Joints to Concrete Abutments with Glued-In Steel Rod, and . Timber for a livable future : World Conference on Timber Engineering : WCTE 2023 : 19-22 June 2023, Oslo, Norway, 3, page 1443-1452. Red Hook, Curran Associates, Inc., (2023)
Rigid Glulam Joints to Concrete Abutments with Glued-In Steel Rod, and . Timber for a livable future : World Conference on Timber Engineering : WCTE 2023 : 19-22 June 2023, Oslo, Norway, 3, page 1443-1452. Red Hook, Curran Associates, Inc., (2023)Semi-Integral Full-Scale Stuttgart Timber Model Bridge, and . Timber for a livable future : World Conference on Timber Engineering : WCTE 2023 : 19-22 June 2023, Oslo, Norway, 5, page 3264-3271. Red Hook, Curran Associates, Inc., (2023)

Simon Eckstein University of Stuttgart

State- Based Control for an Actuated Reciprocal Gait Orthosis, , , , and . 2023 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS), page 6075-6081. IEEE, (2023)
 

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Minimally Invasive Sensors for Transurethral Impedance Spectroscopy, , , , , and . IEEE sensors journal, 21 (20): 22858-22867 (2021)Erweiterung des Einsatzbereiches von laserstrukturierten 3D-MID durch die Verwendung von keramischen Substratmaterialien, , , , , , , , and . MikroSystemTechnik Congress 2021, (2021)Selektive laserinduzierte metallisierung von 3D-schaltungsträgern aus aluminiumoxid, , , , , and . Keramische Zeitschrift, (2020)Evaluating thermoset resin substrates for 3D mechatronic integrated devices and packaging, , , , , , , and . IMAPS 2020 Symposium on Microelectronics : A Global Virtual Conference, 2020, 01, page 140-145. Pittsburgh, International Microelectronics And Packaging Society, (2020)Evaluating thermoset resin substrates for 3D mechatronic integrated devices and packaging, , , , , , , and . International Symposium on Microelectronics, 2020 (1): 000140-000145 (January 2021)3D Conductive Tracks on Thermoset Packages for Advanced System Integration, , , , , , and . Proceedings of the 14th International Congress Molded Interconnect Devices, page 570-594. Molded Interconnect Devices 3-D MID e. V., (February 2021)Erweiterung des Einsatzbereiches von laserstrukturierten 3D-MID durch die Verwendung von keramischen Substratmaterialien, , , , , , , , and . MikroSystemTechnik Congress 2021, page 462-465. Berlin, VDE Verlag, (2021)Untersuchung zum Einfluss von Füllstoffen auf die Laserstrukturierung und selektive Metallisierung kommerzieller Duroplaste. (2014)Erweiterung des Einsatzbereiches von laserstrukturierten 3D-MID durch die Verwendung von keramischen Substratmaterialien, , , , , , , , and . MikroSystemTechnik Kongress 2021, page 462-465. VDE Verlag GmbH, (2021)Flexural Fatigue Test—A Proposed Method to Characterize the Lifetime of Conductor Tracks on Polymeric Substrates, , , , , , , , and . Journal of Manufacturing and Materials Processing, (2022)