%0 Journal Article %1 journals/mr/XuLSCWS11 %A Xu, H. %A Liu, C. %A Silberschmidt, V. V. %A Chen, Z. %A Wei, J. %A Sivakumar, M. %D 2011 %J Microelectronics Reliability %K dblp %N 1 %P 113-118 %T Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution. %U http://dblp.uni-trier.de/db/journals/mr/mr51.html#XuLSCWS11 %V 51

@article{journals/mr/XuLSCWS11, added-at = {2011-04-21T00:00:00.000+0200}, author = {Xu, H. and Liu, C. and Silberschmidt, V. V. and Chen, Z. and Wei, J. and Sivakumar, M.}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/292dc450122bb2800332fc0b78e401bde/dblp}, ee = {http://dx.doi.org/10.1016/j.microrel.2010.03.016}, interhash = {e910335937de490d252e4e0b8aa612cb}, intrahash = {92dc450122bb2800332fc0b78e401bde}, journal = {Microelectronics Reliability}, keywords = {dblp}, number = 1, pages = {113-118}, timestamp = {2016-02-02T02:00:17.000+0100}, title = {Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr51.html#XuLSCWS11}, volume = 51, year = 2011 }