Polymer based multifunctional 3D-packages for microsystems
W. Eberhardt, D. Ahrendt, U. Keßler, und D. Warkentin. Second International Conference on Multi-Material Micro Manufacture Proceedings, Seite 67-70. Elsevier, (September 2006)
Zusammenfassung
Multifunctional 3D-packages can be fabricated with nearly any geometry using injection moulding. 3D line patterning can be performed on injection moulded parts with very flexible laser techniques. Finest line pitches can be realized with subtractive patterning as well as with additive laser direct structuring (LDS). For mounting of SMD and bare dies different assembly techniques can be used.
%0 Conference Paper
%1 eberhardt2006polymer
%A Eberhardt, Wolfgang
%A Ahrendt, D.
%A Keßler, U.
%A Warkentin, D.
%B Second International Conference on Multi-Material Micro Manufacture Proceedings
%D 2006
%E Menz, Wolfgang
%E Dimov, Stefan
%E Fillon, Bertrand
%I Elsevier
%K ifm_conf kueck
%P 67-70
%T Polymer based multifunctional 3D-packages for microsystems
%U https://www.4m-association.org/content/4M-conference-series/4m-conference-series.html
%X Multifunctional 3D-packages can be fabricated with nearly any geometry using injection moulding. 3D line patterning can be performed on injection moulded parts with very flexible laser techniques. Finest line pitches can be realized with subtractive patterning as well as with additive laser direct structuring (LDS). For mounting of SMD and bare dies different assembly techniques can be used.
%@ 978-0-08-045263-9
@inproceedings{eberhardt2006polymer,
abstract = {Multifunctional 3D-packages can be fabricated with nearly any geometry using injection moulding. 3D line patterning can be performed on injection moulded parts with very flexible laser techniques. Finest line pitches can be realized with subtractive patterning as well as with additive laser direct structuring (LDS). For mounting of SMD and bare dies different assembly techniques can be used.},
added-at = {2023-06-16T08:08:16.000+0200},
author = {Eberhardt, Wolfgang and Ahrendt, D. and Keßler, U. and Warkentin, D.},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2f2652da5fe79d8c60ad95bd0c4f5132e/holgerruehl},
booktitle = {Second International Conference on Multi-Material Micro Manufacture Proceedings},
editor = {Menz, Wolfgang and Dimov, Stefan and Fillon, Bertrand},
eventtitle = {Second International Conference on Multi-Material Micro Manufacture},
interhash = {4996cb8b82f3f3e41d0933cbb1e230d4},
intrahash = {f2652da5fe79d8c60ad95bd0c4f5132e},
isbn = {978-0-08-045263-9},
keywords = {ifm_conf kueck},
month = {09},
pages = {67-70},
publisher = {Elsevier},
timestamp = {2023-06-16T08:08:16.000+0200},
title = {Polymer based multifunctional 3D-packages for microsystems},
url = {https://www.4m-association.org/content/4M-conference-series/4m-conference-series.html},
venue = {Grenoble},
year = 2006
}