Cost-effective electronic packaging technology plays a vital role in the manufacturing industry with ever increasing demand for microelectronics and microsystems. The application of thermoset encapsulation of electronic parts offers a wide range of advantages with respect to thermal, mechanical and chemical properties. Transfer Molding, mainly available in the Far East, is dominantly used for the manufacturing of such polymeric packages 2. Thermoset injection molding extends a good scope of advantages over transfer molding like availability in Europe and ease of raw material handling. The implementation of thermoset injection molding for encapsulation of electronic components provides the European small and medium-sized enterprises (SMEs) with access to customized packaging solutions. The feasibility of this implementation is defined and tested in this work.
%0 Conference Paper
%1 kulkarni2017feasibility
%A Kulkarni, Romit Ashokk
%A Hera, Daniel
%A Soltani, Mahdi
%A Günther, Thomas
%A Grözinger, Tobias
%A Zimmermann, André
%B Smart Systems Integration
%D 2017
%K myown myownsend:unibiblio
%T Feasibility of manufacturing packaged electronic systems by thermoset injection molding
%X Cost-effective electronic packaging technology plays a vital role in the manufacturing industry with ever increasing demand for microelectronics and microsystems. The application of thermoset encapsulation of electronic parts offers a wide range of advantages with respect to thermal, mechanical and chemical properties. Transfer Molding, mainly available in the Far East, is dominantly used for the manufacturing of such polymeric packages 2. Thermoset injection molding extends a good scope of advantages over transfer molding like availability in Europe and ease of raw material handling. The implementation of thermoset injection molding for encapsulation of electronic components provides the European small and medium-sized enterprises (SMEs) with access to customized packaging solutions. The feasibility of this implementation is defined and tested in this work.
@inproceedings{kulkarni2017feasibility,
abstract = {Cost-effective electronic packaging technology plays a vital role in the manufacturing industry with ever increasing demand for microelectronics and microsystems. The application of thermoset encapsulation of electronic parts offers a wide range of advantages with respect to thermal, mechanical and chemical properties. Transfer Molding, mainly available in the Far East, is dominantly used for the manufacturing of such polymeric packages [2]. Thermoset injection molding extends a good scope of advantages over transfer molding like availability in Europe and ease of raw material handling. The implementation of thermoset injection molding for encapsulation of electronic components provides the European small and medium-sized enterprises (SMEs) with access to customized packaging solutions. The feasibility of this implementation is defined and tested in this work.},
added-at = {2019-03-15T13:47:38.000+0100},
author = {Kulkarni, Romit Ashokk and Hera, Daniel and Soltani, Mahdi and Günther, Thomas and Grözinger, Tobias and Zimmermann, André},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2eafa6980a14859542107e912ca6b12e7/thomasguenther},
booktitle = {Smart Systems Integration},
eventdate = {March},
interhash = {92f3fc6b74158693e3f1781003bd420d},
intrahash = {eafa6980a14859542107e912ca6b12e7},
keywords = {myown myownsend:unibiblio},
timestamp = {2019-03-29T14:37:27.000+0100},
title = {Feasibility of manufacturing packaged electronic systems by thermoset injection molding},
venue = {Cork, Ireland},
year = 2017
}
