%0 Journal Article %1 Riefer_CIPS2022 %A Riefer, M. %A Winkler, J. %A Strache, S %A Kallfass, I %D 2022 %J in Proc. International Conference on Integrated Power Electronics Systems (CIPS), Berlin %K PUMA in update %T Substrate Integrated Temperature Sensing for Bondless Power Modules

@article{Riefer_CIPS2022, added-at = {2022-11-04T11:48:46.000+0100}, author = {Riefer, M. and Winkler, J. and Strache, S and Kallfass, I}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2e0d1f7652928fdd696a8e02b3048c703/ingmarkallfass}, date-added = {2021-01-21 16:14:11 +0100}, date-modified = {2021-11-07 19:34:44 +0100}, interhash = {4aff79fd17f4eb95958f622444642c8c}, intrahash = {e0d1f7652928fdd696a8e02b3048c703}, journal = {in Proc. International Conference on Integrated Power Electronics Systems (CIPS), Berlin}, keywords = {PUMA in update}, month = {Mar.}, timestamp = {2025-05-26T10:46:15.000+0200}, title = {Substrate Integrated Temperature Sensing for Bondless Power Modules}, year = 2022 }