%0 Conference Paper %1 kessler2005multifunctional %A Keßler, Ulrich %A Pein, Carsten %A Eberhardt, Wolfgang %A Kueck, Heinz %B First International Conference on Multi-Material Micro Manufacture Proceedings %D 2005 %E Menz, Wolfang %E Dimov, Stefan %I Elsevier %K ifm_conf kueck %P 315-318 %T Multifunctional Packages by Assembly of SMD and Bare Dies on Molded Interconnect Devices (MID) %U https://www.4m-association.org/content/4M-conference-series/4m-conference-series.html %X The technology of Molded Interconnect Devices (MID) offers a very interesting alternative for many applications in MEMS and MOEMS suitable for multifunctional packages, because of its high potential in reducing the number of components and process steps as well as in miniaturization. In order to tap the full potential, the assembly of different kinds of electronic components like SMD and bare dies has to be feasible. In this paper the latest research results on the assembly of SMD and flipchips on laser patterned and electroless plated MIDs are presented. Both lead free soldering and bonding with electrically conductive adhesives was used for assembling SMD. Thereby the high peak temperature in the reflow process demands for a high temperature stability of the thermoplastic substrates. Flipchips were assembled using different kinds of adhesives on various substrates, including a special new type with molded polymer bumps in order to substitute the expensive process of stud bump bonding. The transition resistance of the contacts and the shear strength have been measured as an indicator for process quality and reliability after temperature shock and humidity storage stress. The thermal coefficient of expansion of the substrates used was found to have a major influence on the reliability. Reliable and suitable processes for various applications could be found. %@ 0-080-44879-8

@inproceedings{kessler2005multifunctional, abstract = {The technology of Molded Interconnect Devices (MID) offers a very interesting alternative for many applications in MEMS and MOEMS suitable for multifunctional packages, because of its high potential in reducing the number of components and process steps as well as in miniaturization. In order to tap the full potential, the assembly of different kinds of electronic components like SMD and bare dies has to be feasible. In this paper the latest research results on the assembly of SMD and flipchips on laser patterned and electroless plated MIDs are presented. Both lead free soldering and bonding with electrically conductive adhesives was used for assembling SMD. Thereby the high peak temperature in the reflow process demands for a high temperature stability of the thermoplastic substrates. Flipchips were assembled using different kinds of adhesives on various substrates, including a special new type with molded polymer bumps in order to substitute the expensive process of stud bump bonding. The transition resistance of the contacts and the shear strength have been measured as an indicator for process quality and reliability after temperature shock and humidity storage stress. The thermal coefficient of expansion of the substrates used was found to have a major influence on the reliability. Reliable and suitable processes for various applications could be found.}, added-at = {2023-06-16T08:32:06.000+0200}, author = {Keßler, Ulrich and Pein, Carsten and Eberhardt, Wolfgang and Kueck, Heinz}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2d7be4d59f237575cf32a9815190381a5/holgerruehl}, booktitle = {First International Conference on Multi-Material Micro Manufacture Proceedings}, editor = {Menz, Wolfang and Dimov, Stefan}, eventtitle = {First International Conference on Multi-Material Micro Manufacture}, interhash = {d6271a70f65fbda5bb0c26755f8b223c}, intrahash = {d7be4d59f237575cf32a9815190381a5}, isbn = {0-080-44879-8}, keywords = {ifm_conf kueck}, pages = {315-318}, publisher = {Elsevier}, timestamp = {2023-06-16T08:32:06.000+0200}, title = {Multifunctional Packages by Assembly of SMD and Bare Dies on Molded Interconnect Devices (MID)}, url = {https://www.4m-association.org/content/4M-conference-series/4m-conference-series.html}, venue = {Karlsruhe}, year = 2005 }