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Strained Ge Channels with High Hole Mobility Grown on Si Substrates by Molecular Beam Epitaxy

, , , , , , and . 2021 44th International Convention on Information, Communication and Electronic Technology (MIPRO), page 40-44. (September 2021)
DOI: 10.23919/MIPRO52101.2021.9597145

Abstract

Strained modulation-doped quantum wells (QW) offer a huge potential for semiconductor device applications due to their high mobility. The material Ge is particularly interesting here, exhibiting the highest bulk hole-mobility of all known semiconductors. However, the growth for Ge QW structures is quite complex and a special virtual substrate (VS) technique is needed. The VS is commonly grown with thicknesses of over <tex>$1\ m$</tex>, making it difficult for integration with other devices on a single chip. In this paper, we report on the growth of a 15 nm thick strained Ge QW on top of a <tex>$Si_1-xGe_x$</tex> VS and <tex>$Si_0.2Ge_0.8$</tex> buffer layer, using Molecular Beam Epitaxy. The <tex>$Si_1-xGe_x$</tex> VS is grown by deposition of 100 nm Ge with a subsequent high-temperature annealing step, followed by a 100 nm thick <tex>$Si_0.2Ge_0.8$</tex> buffer layer. The resulting two-dimensional hole gas reaches a hole mobility of over <tex>$810^4cm^2V^-1s^-1$</tex> with a corresponding sheet carrier density of <tex>$5.710^11cm^-2$</tex> at 8 K. The Ge QW is further analysed, and comparing it to a sample with a higher VS thickness, a possible limitation of the mobility due to background doping is being discussed. These results show that complementary metal-oxide-semiconductor (CMOS) compatible device integration of the Ge QW is possible, thin buffer layers suffice for the mobilities achieved and background doping limits the low-temperature mobility.

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Strained Ge Channels with High Hole Mobility Grown on Si Substrates by Molecular Beam Epitaxy | IEEE Conference Publication | IEEE Xplore

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