A novel process for laser induced selective metallization of alumina substrates is presented. Alumina substrates are provided by ceramic injection molding, whereby three-dimensional shaping of the ceramic parts is feasible. Laser patterning activates the surface and enables fully additive metal deposition by electroless plating. As the focus diameter of the used picosecond pulsed laser is about 10 μm very fine metal lines can be achieved. The metal layer thickness is comparable to conducting paths fabricated by LPKF-LDS technology onthermoplastic substrates, whereas the adhesion is significantly stronger and promises high reliability. The low metal surface roughness enables the assembly of electronic components on the ceramic devices.
%0 Conference Paper
%1 mueller2018laser
%A Mueller, Hagen
%A Ermantraut, Eugen
%A Wolf, Marius
%A Eberhardt, Wolfgang
%A Ninz, Philipp
%A Kern, Frank
%A Gadow, Rainer
%A Zimmermann, André
%B 13th International Congress Molded Interconnect Devices
%D 2018
%K ermantraut from:holgerruehl ifm_conf wolf zimmermann
%P 328
%R 10.1109/ICMID.2018.8526993
%T Laser Induced Selective Metallization of 3D Ceramic Interconnect Devices
%U https://ieeexplore.ieee.org/document/8526993
%X A novel process for laser induced selective metallization of alumina substrates is presented. Alumina substrates are provided by ceramic injection molding, whereby three-dimensional shaping of the ceramic parts is feasible. Laser patterning activates the surface and enables fully additive metal deposition by electroless plating. As the focus diameter of the used picosecond pulsed laser is about 10 μm very fine metal lines can be achieved. The metal layer thickness is comparable to conducting paths fabricated by LPKF-LDS technology onthermoplastic substrates, whereas the adhesion is significantly stronger and promises high reliability. The low metal surface roughness enables the assembly of electronic components on the ceramic devices.
%@ 978-3-00-060821-6
@inproceedings{mueller2018laser,
abstract = {A novel process for laser induced selective metallization of alumina substrates is presented. Alumina substrates are provided by ceramic injection molding, whereby three-dimensional shaping of the ceramic parts is feasible. Laser patterning activates the surface and enables fully additive metal deposition by electroless plating. As the focus diameter of the used picosecond pulsed laser is about 10 μm very fine metal lines can be achieved. The metal layer thickness is comparable to conducting paths fabricated by LPKF-LDS technology onthermoplastic substrates, whereas the adhesion is significantly stronger and promises high reliability. The low metal surface roughness enables the assembly of electronic components on the ceramic devices.},
added-at = {2023-06-19T11:01:05.000+0200},
author = {Mueller, Hagen and Ermantraut, Eugen and Wolf, Marius and Eberhardt, Wolfgang and Ninz, Philipp and Kern, Frank and Gadow, Rainer and Zimmermann, André},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/21fbb8685548d5f4a2ad49a6d6456a165/ifm},
booktitle = {13th International Congress Molded Interconnect Devices},
doi = {10.1109/ICMID.2018.8526993},
eventtitle = {2018 13th International Congress Molded Interconnect Devices (MID)},
interhash = {1c2c0e68935649fba1e7ab1f8f9e0ac6},
intrahash = {1fbb8685548d5f4a2ad49a6d6456a165},
isbn = {978-3-00-060821-6},
issn = {2197-6090},
keywords = {ermantraut from:holgerruehl ifm_conf wolf zimmermann},
month = {09},
organization = {Molded Interconnect Devices 3-D MID e. V.},
pages = 328,
timestamp = {2023-06-19T17:13:57.000+0200},
title = {Laser Induced Selective Metallization of 3D Ceramic Interconnect Devices},
url = {https://ieeexplore.ieee.org/document/8526993},
venue = {Würzburg},
year = 2018
}
