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%0 Journal Article
%1 journals/mr/KuczynskaSBMKBW17
%A Kuczynska, Marta
%A Schafet, Natalja
%A Becker, Ulrich
%A Métais, B.
%A Kabakchiev, Alexander
%A Buhl, P.
%A Weihe, Stefan
%D 2017
%J Microelectronics Reliability
%K dblp
%P 155-164
%T The role of stress state and stress triaxiality in lifetime prediction of solder joints in different packages utilized in automotive electronics.
%U http://dblp.uni-trier.de/db/journals/mr/mr74.html#KuczynskaSBMKBW17
%V 74
@article{journals/mr/KuczynskaSBMKBW17,
added-at = {2019-05-29T00:00:00.000+0200},
author = {Kuczynska, Marta and Schafet, Natalja and Becker, Ulrich and Métais, B. and Kabakchiev, Alexander and Buhl, P. and Weihe, Stefan},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/24120dbee9ff159b45d60416c679d818a/dblp},
ee = {https://doi.org/10.1016/j.microrel.2017.04.013},
interhash = {21a2f0259ecb63c532c5a5531ec00674},
intrahash = {4120dbee9ff159b45d60416c679d818a},
journal = {Microelectronics Reliability},
keywords = {dblp},
pages = {155-164},
timestamp = {2019-09-27T10:58:34.000+0200},
title = {The role of stress state and stress triaxiality in lifetime prediction of solder joints in different packages utilized in automotive electronics.},
url = {http://dblp.uni-trier.de/db/journals/mr/mr74.html#KuczynskaSBMKBW17},
volume = 74,
year = 2017
}