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%0 Conference Paper
%1 conf/isscc/KangCHALCAKKLJKKLKMJKCOLJYK09
%A Kang, Uksong
%A Chung, Hoeju
%A Heo, Seongmoo
%A Ahn, Soon-Hong
%A Lee, Hoon
%A Cha, Sooho
%A Ahn, Jaesung
%A Kwon, Dukmin
%A Kim, Jin Ho
%A Lee, Jaewook
%A Joo, Han-Sung
%A Kim, Woo-Seop
%A Kim, Hyun-Kyung
%A Lee, Eun-Mi
%A Kim, So-Ra
%A Ma, Keum-Hee
%A Jang, Dong-Hyun
%A Kim, Nam-Seog
%A Choi, Man-Sik
%A Oh, Sae-Jang
%A Lee, Jung-Bae
%A Jung, Tae-Kyung
%A Yoo, Jei-Hwan
%A Kim, Changhyun
%B ISSCC
%D 2009
%I IEEE
%K dblp
%P 130-131
%T 8Gb 3D DDR3 DRAM using through-silicon-via technology.
%U http://dblp.uni-trier.de/db/conf/isscc/isscc2009.html#KangCHALCAKKLJKKLKMJKCOLJYK09
%@ 978-1-4244-3458-9
@inproceedings{conf/isscc/KangCHALCAKKLJKKLKMJKCOLJYK09,
added-at = {2011-10-19T00:00:00.000+0200},
author = {Kang, Uksong and Chung, Hoeju and Heo, Seongmoo and Ahn, Soon-Hong and Lee, Hoon and Cha, Sooho and Ahn, Jaesung and Kwon, Dukmin and Kim, Jin Ho and Lee, Jaewook and Joo, Han-Sung and Kim, Woo-Seop and Kim, Hyun-Kyung and Lee, Eun-Mi and Kim, So-Ra and Ma, Keum-Hee and Jang, Dong-Hyun and Kim, Nam-Seog and Choi, Man-Sik and Oh, Sae-Jang and Lee, Jung-Bae and Jung, Tae-Kyung and Yoo, Jei-Hwan and Kim, Changhyun},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2c39185c8cf4e3a46081224cc9a0e9c06/dblp},
booktitle = {ISSCC},
crossref = {conf/isscc/2009},
ee = {http://dx.doi.org/10.1109/ISSCC.2009.4977342},
interhash = {ea6e858ded71a630fc733568e41eede9},
intrahash = {c39185c8cf4e3a46081224cc9a0e9c06},
isbn = {978-1-4244-3458-9},
keywords = {dblp},
pages = {130-131},
publisher = {IEEE},
timestamp = {2016-02-02T12:12:49.000+0100},
title = {8Gb 3D DDR3 DRAM using through-silicon-via technology.},
url = {http://dblp.uni-trier.de/db/conf/isscc/isscc2009.html#KangCHALCAKKLJKKLKMJKCOLJYK09},
year = 2009
}
