%0 Conference Paper %1 conf/3dic/KaulLPYB21 %A Kaul, Ankit %A Luo, Yandong %A Peng, Xiaochen %A Yu, Shimeng %A Bakir, Muhannad S. %B 3DIC %D 2021 %I IEEE %K dblp %P 1-5 %T Thermal Reliability Considerations of Resistive Synaptic Devices for 3D CIM System Performance. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2021.html#KaulLPYB21 %@ 978-1-6654-1706-8

@inproceedings{conf/3dic/KaulLPYB21, added-at = {2022-02-18T00:00:00.000+0100}, author = {Kaul, Ankit and Luo, Yandong and Peng, Xiaochen and Yu, Shimeng and Bakir, Muhannad S.}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2774390f013404679374f9c9a388a4f11/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2021}, ee = {https://doi.org/10.1109/3DIC52383.2021.9687612}, interhash = {e970395097cb4e8af152f457547e8001}, intrahash = {774390f013404679374f9c9a388a4f11}, isbn = {978-1-6654-1706-8}, keywords = {dblp}, pages = {1-5}, publisher = {IEEE}, timestamp = {2022-03-01T06:56:05.000+0100}, title = {Thermal Reliability Considerations of Resistive Synaptic Devices for 3D CIM System Performance.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2021.html#KaulLPYB21}, year = 2021 }