%0 Journal Article %1 journals/mr/DohlePKSR11 %A Dohle, Rainer %A Petzold, Matthias %A Klengel, Robert %A Schulze, Holger %A Rudolf, Frank %D 2011 %J Microelectronics Reliability %K dblp %N 1 %P 97-106 %T Room temperature wedge-wedge ultrasonic bonding using aluminum coated copper wire. %U http://dblp.uni-trier.de/db/journals/mr/mr51.html#DohlePKSR11 %V 51

@article{journals/mr/DohlePKSR11, added-at = {2011-04-21T00:00:00.000+0200}, author = {Dohle, Rainer and Petzold, Matthias and Klengel, Robert and Schulze, Holger and Rudolf, Frank}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2b8afd041b8da92a88aab05ace97a0e93/dblp}, ee = {http://dx.doi.org/10.1016/j.microrel.2010.08.001}, interhash = {aef1621fe1be2d089aed5efc6108a096}, intrahash = {b8afd041b8da92a88aab05ace97a0e93}, journal = {Microelectronics Reliability}, keywords = {dblp}, number = 1, pages = {97-106}, timestamp = {2016-02-02T02:01:11.000+0100}, title = {Room temperature wedge-wedge ultrasonic bonding using aluminum coated copper wire.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr51.html#DohlePKSR11}, volume = 51, year = 2011 }