%0 Journal Article %1 journals/mr/ChenLL11 %A Chen, Zhaohui %A Liu, Yong %A Liu, Sheng %D 2011 %J Microelectronics Reliability %K dblp %N 1 %P 171-178 %T Modeling of copper wire bonding process on high power LEDs. %U http://dblp.uni-trier.de/db/journals/mr/mr51.html#ChenLL11 %V 51

@article{journals/mr/ChenLL11, added-at = {2011-04-21T00:00:00.000+0200}, author = {Chen, Zhaohui and Liu, Yong and Liu, Sheng}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/23478ef5d5b84c43273b3a785be39614a/dblp}, ee = {http://dx.doi.org/10.1016/j.microrel.2010.03.001}, interhash = {9be2abdd4f6c1b543c395855cea11186}, intrahash = {3478ef5d5b84c43273b3a785be39614a}, journal = {Microelectronics Reliability}, keywords = {dblp}, number = 1, pages = {171-178}, timestamp = {2016-02-02T02:01:31.000+0100}, title = {Modeling of copper wire bonding process on high power LEDs.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr51.html#ChenLL11}, volume = 51, year = 2011 }