%0 Conference Paper %1 conf/ets/MetzlerTBDGV12 %A Metzler, Carolina %A Todri, Aida %A Bosio, Alberto %A Dilillo, Luigi %A Girard, Patrick %A Virazel, Arnaud %B European Test Symposium %D 2012 %I IEEE Computer Society %K dblp %P 1 %T Through-Silicon-Via resistive-open defect analysis. %U http://dblp.uni-trier.de/db/conf/ets/ets2012.html#MetzlerTBDGV12 %@ 978-1-4673-0697-3

@inproceedings{conf/ets/MetzlerTBDGV12, added-at = {2013-11-20T00:00:00.000+0100}, author = {Metzler, Carolina and Todri, Aida and Bosio, Alberto and Dilillo, Luigi and Girard, Patrick and Virazel, Arnaud}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2f61787c2c5dcf7ed9803fb82263040bb/dblp}, booktitle = {European Test Symposium}, crossref = {conf/ets/2012}, ee = {http://dx.doi.org/10.1109/ETS.2012.6233037}, interhash = {4086bf0309a3f92000c575c5f7a77601}, intrahash = {f61787c2c5dcf7ed9803fb82263040bb}, isbn = {978-1-4673-0697-3}, keywords = {dblp}, pages = 1, publisher = {IEEE Computer Society}, timestamp = {2016-09-07T09:34:04.000+0200}, title = {Through-Silicon-Via resistive-open defect analysis.}, url = {http://dblp.uni-trier.de/db/conf/ets/ets2012.html#MetzlerTBDGV12}, year = 2012 }